Mechanical structures for electrical and electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 6: Security aspects for indoor cabinets
€88.00
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 47D/886/CDV:2016); German version prEN 60191-1:2016
€128.22
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 47D/882/CD:2016)
€105.42
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 1: Environmental requirements, test set-up and safety aspects for cabinets, racks, subracks and chassis under indoor condition use and transportation
€325.00
Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes (IEC 40/2425/CD:2015)
€69.91
Mechanical structures for electrical and electronic equipment - Aisle containment for IT cabinets - Part 1: Dimensions and mechanical requirements (IEC 48D/585A/CD:2015)
€91.03
Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules (IEC 49/1141/CD:2015)
€98.32
Packaging of components for automatic handling with unidirectional leads on continuous tapes
€316.00
Packaging of components for automatic handling - Part 2: Tape packaging of components with unidirectional leads on continuous tapes
€286.00
Packaging of components for automatic handling - Part 3 : packaging of surface mount components on continuous tapes
€138.00
Emballage des composants pour opérations automatisées - Partie 3-1 : emballage des composants appropriés au montage en surface en bandes continues - Type V : bandes porteuses pressées
€95.67
Emballage de composants pour opérations automatisées - Partie 3-2 : emballage des composants appropriés au montage en surface en bandes continues - Type VI - Bandes porteuses à cloques de 4 mm de large
€77.67
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013); German version EN 60191-4:2014.
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2011 + A1:2014); German version EN 61837-2:2011 + A1:2014.
€229.44
Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 5: Guideline of cooling performance evaluation for indoor cabinets (IEC 48D/558/CD:2014)
€84.58
