31.240 : Mechanical structures for electronic equipment

PNE-prEN IEC 61760-1:2025

PNE-prEN IEC 61760-1:2025

Withdrawn Most Recent

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs).

€102.00

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PNE-EN IEC 61587-1:2022/prA1:2025

PNE-EN IEC 61587-1:2022/prA1:2025

Withdrawn Most Recent

Amendment 1 - Mechanical structures for electrical and electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 1: Environmental requirements, test setups and safety aspects

€20.00

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PNE-prEN IEC 60297-3-103

PNE-prEN IEC 60297-3-103

Withdrawn Most Recent

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-103: Keying and alignment pin

€67.00

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PNE-prEN IEC 61969-3:2026

PNE-prEN IEC 61969-3:2026

Withdrawn Most Recent

Mechanical structures for electrical and electronic equipment - Outdoor enclosures - Part 3: Environmental requirements, tests and safety aspects

€107.00

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PNE-prEN IEC 60297-3-101

PNE-prEN IEC 60297-3-101

Withdrawn Most Recent

Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-101: Subracks and associated plug-in units

€101.00

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PNE-EN 60286-1:2017/prA2:2026

PNE-EN 60286-1:2017/prA2:2026

Withdrawn Most Recent

Amendment 2 - Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes

€41.00

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DIN EN IEC 60286-3:2022-07

DIN EN IEC 60286-3:2022-07

Superseded Historical

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 40/2845/CD:2021); Text in German and English

€167.66

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DIN EN IEC 60749-39:2021-07

DIN EN IEC 60749-39:2021-07

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 47/2652/CDV:2020); English version prEN IEC 60749-39:2020

€63.27

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DIN EN 60286-1/A1:2021-02

DIN EN 60286-1/A1:2021-02

Superseded Historical

Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes (IEC 40/2746/CD:2020); Text in German and English

€48.79

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DIN EN IEC 61837-2/A1:2020-12

DIN EN IEC 61837-2/A1:2020-12

Superseded Historical

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 49/1338/CDV:2020); German and English version EN IEC 61837-2:2018/prA1:2020

€116.64

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ASTM F375-20

ASTM F375-20

Withdrawn Most Recent

Standard Specification for Integrated Circuit Lead Frame Material (Withdrawn 2023)

This product is not for sale, please contact us for more information

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BS EN IEC 61969-3:2020

BS EN IEC 61969-3:2020

Superseded Historical

Mechanical structures for electrical and electronic equipment. Outdoor enclosures Environmental requirements, tests safety aspects

€193.00

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IEC 61760-1:2020

IEC 61760-1:2020

Superseded Historical

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

€325.00

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BS EN IEC 61969-1:2020

BS EN IEC 61969-1:2020

Superseded Historical

Mechanical structures for electrical and electronic equipment. Outdoor enclosures Design guidelines

€193.00

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IEC 61969-3:2020

IEC 61969-3:2020

Superseded Historical

Mechanical structures for electrical and electronic equipment - Outdoor enclosures - Part 3: Environmental requirements, tests and safety aspects

€88.00

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