Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191-6-1:2001
€56.17
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001); German version EN 60191-6-5:2001
€77.20
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); German version EN 60191-6-8:2001
Recommendations for shielded enclosures.
€59.00
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001); German version EN 60191-6-6:2001
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000
€63.27
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999
€145.14
Modular power supply units for systems for signalling equipment, telecommunications equipment and computer equipment. Convecter module. - Installations fixes ferroviaires
€107.33
Railway fixed equipment. Modular power supply units for systems for signalling equipment, telecommunications equipment and computer equipment. Rectifier cabinet. - Installations fixes ferroviaires
€82.00
MODULAR ORDER FOR THE DEVELOPMENT OF MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT PRACTICES. PART 2: SECTIONAL SPECIFICATION. INTERFACE CO-ORDINATION DIMENSIONS FOR THE 25 MM EQUIPMENT PRACTICE. SECTION 2: DETAIL SPECIFICATION. DIMENSIONS FOR SUBRACKS, CHASSIS, BACKPLANES, FRONT PANELS AND PLUG-IN UNITS.
€84.00
Modular order for the development of mechanical structures electronic equipment practices. Sectional specification. Interface co-ordination dimensions 25 mm practice Detail Dimensions cabinets and racks
€193.00
Modular order for the development of mechanical structures electronic equipment practices. Sectional specification. Interface co-ordination dimensions 25 mm practice Detail Dimensions subracks, chassis, backplanes, front panels and plug-in units
€316.00
Railway fixed equipment. Modulated switchgear enclosures. Classification, definition of test and approval procedures. - Installations fixes ferroviaires
€52.00
Ordre modulaire pour le développement des structures mécaniques pour les infrastructures électroniques - Partie 2 : spécification intermédiaire - Dimensions de coordination pour les interfaces des infrastructures au pas de 25 mm.
€95.67
Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification; interface coordination dimensions for the 25 mm equipment practice; section 2: Detail specification; dimensions for subracks, chassis, backplanes, front panels and plug-in units (IEC 60917-2-2:1994); German version EN 60917-2-2:1996
€98.32
