Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012); German version EN 60191-6-22:2013
€98.32
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosure (IEC 49/1030/CD:2013)
€105.42
Surface mounted piezoelectric devices for frequency control and selection - Standard outline and terminal lead connections - Part 4: Hybrid enclosure outline (IEC 49/1031/CD:2013)
€84.58
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 47D/834/CD:2013)
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 47D/835/CD:2013)
Modular order for the development of mechanical structures for electronic equipment practices - Part 2-5: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Cabinet interface dimensions for miscellaneous equipment (IEC 60917-2-5:2012); German version EN 60917-2-5:2012
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013); German version EN 60191-4:2014.
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2011 + A1:2014); German version EN 61837-2:2011 + A1:2014.
€229.44
Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 5: Guideline of cooling performance evaluation for indoor cabinets (IEC 48D/558/CD:2014)
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 1: Plastic moulded enclosure outlines (IEC 61837-1:2012); German version EN 61837-1:2012.
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 61760-1:2020); German version EN IEC 61760-1:2020.
€145.14
Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes (IEC 60286-1:2017 + A1:2021); German version EN 60286-1:2017 + A1:2021.
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 49/1338/CDV:2020); German and English version EN IEC 61837-2:2018/prA1:2020
€116.64
Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes (IEC 40/2746/CD:2020); Text in German and English
€48.79
Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 6: Air recirculation and bypass of indoor cabinets (IEC 62610-6:2020); German version EN IEC 62610-6:2020
€111.40
