Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-102: Injector/extractor handle (IEC 60297-3-102:2004); German version EN 60297-3-102:2004.
€69.91
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-101: Subracks and associated plug-in units (IEC 60297-3-101:2004); German version EN 60297-3-101:2004.
€105.42
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-103: Keying and alignment pin (IEC 60297-3-103:2004); German version EN 60297-3-103:2004.
€91.03
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-101 : subracks and associated plug-in units - Structures mécaniques pour équipement électronique
€125.00
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-103 : keying and alignment pin - Structures mécaniques pour équipement électronique
€114.00
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-102 : injector/extractor handle - Structures mécaniques pour équipement électronique
€25.33
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-101: Subracks and associated plug-in units
€176.00
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-102: Injector/extractor handle
€88.00
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-103: Keying and alignment pin
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON (IEC 60191-6-10:2003); German version EN 60191-6-10:2003
€77.20
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003
Connectors for electronic equipment - Tests and measurements - Part 2-6: Electrical continuity and contact resistance tests; Test 2f: Housing (shell) electrical continuity (IEC 60512-2-6:2002); German version EN 60512-2-6:2002.
€41.78
Ordre modulaire pour le développement des structures mécaniques pour les infrastructures électroniques - Partie 2 : spécification intermédiaire - Dimensions de coordination pour les interfaces des infrastructures au pas de 25 mm - Section 2 : spécification particulière - Dimensions pour bacs, châssis, fonds de paniers, faces avant et unités enfichables
€126.00
Ordre modulaire pour le développement des structures mécaniques pour les infrastructures électroniques - Partie 2 : spécification intermédiaire - Dimensions de coordination pour les interfaces des infrastructures au pas de 25 mm - Section 1 : specification particulière - Dimensions pour baies et bâtis
€77.67
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages (IEC 60191-6-2:2001); German version EN 60191-6-2:2002
