Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010); German version EN 60191-6-21:2010
€98.32
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-106: Adaptation dimensions for subracks and chassis applicable with metric cabinets or racks in accordance with IEC 60917-2-1 (IEC 60297-3-106:2010); German version EN 60297-3-106:2010
Modular order for the development of mechanical structures for electronic equipment practices - Part 2-4: Sectional specification - Interface coordination dimensions for the 25 mm equipment practice - Adaptation dimensions for subracks or chassis applicable in cabinets or racks in accordance with IEC 60297-3-100 (19 in) (IEC 60917-2-4:2010); German version EN 60917-2-4:2010
€91.03
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010); German version EN 60191-6-19:2010
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010 + Cor. :2010); German version EN 60191-6-18:2010
€105.42
Recommendations for shielded enclosures
€193.00
Ordre modulaire pour le développement des structures mécaniques pour les infrastructures électroniques - Partie 2-4 : spécification intermédiaire - Dimensions de coordination pour les interfaces des infrastructures au pas de 25 mm - Dimensions d'adaptation des bacs ou des châssis, applicables dans les baies ou les bâtis, conformément à la CEI 60297-3-100 (19 pouces)
€65.33
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-106 : adaptation dimensions for subracks and chassis applicable with metric cabinets or racks in accordance with IEC 60917-2-1 - Structures mécaniques pour équipements électroniques
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009.
€140.00
Mechanical structures for electronic equipment. Dimensions of mechanical the 482,6 mm (19 in) series Adaptation dimensions subracks and chassis applicable with metric cabinets or racks in accordance IEC 60917-2-1
Modular order for the development of mechanical structures electronic equipment practices Sectional specification. Interface coordination dimensions 25 mm practice. Adaptation subracks or chassis applicable in cabinets racks accordance with IEC 60297-3-100 (19 in)
Modular order for the development of mechanical structures for electronic equipment practices - Part 2-4: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Adaptation dimensions for subracks or chassis applicable in cabinets or racks in accordance with IEC 60297-3-100 (19 in)
€88.00
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-106: Adaptation dimensions for subracks and chassis applicable with metric cabinets or racks in accordance with IEC 60917-2-1
Mechanical structures for electronic equipment. Thermal management cabinets in accordance with IEC 60297 and 60917 series Design guide. Evaluation method thermoelectrical cooling systems (Peltier effect)
€316.00
Mechanical structures for electronic equipment. Thermal management cabinets in accordance with IEC 60297 and 60917 series Design guide. Interface dimension provision thermoelectrical cooling systems (Peltier effect)
€269.00
