Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 4: Hybrid enclosure outlines (IEC 61837-4:2004); German version EN 61837-4:2004.
€77.20
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-102: Injector/extractor handle (IEC 60297-3-102:2004); German version EN 60297-3-102:2004.
€69.91
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-101: Subracks and associated plug-in units (IEC 60297-3-101:2004); German version EN 60297-3-101:2004.
€105.42
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-103: Keying and alignment pin (IEC 60297-3-103:2004); German version EN 60297-3-103:2004.
€91.03
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON (IEC 60191-6-10:2003); German version EN 60191-6-10:2003
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003
Sectional specification for outdoor enclosures (IEC 48D/142/CD:1997)
€41.78
Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification; interface coordination dimensions for the 25 mm equipment practice; section 1: Detail specification; dimensions for cabinets and racks (IEC 60917-2-1:1993); German version EN 60917-2-1:1995
€56.17
Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification; interface coordination dimensions for the 25 mm equipment practice; section 2: Detail specification; dimensions for subracks, chassis, backplanes, front panels and plug-in units (IEC 60917-2-2:1994); German version EN 60917-2-2:1996
€98.32
Surface acoustic wave (SAW) resonators; part 3: standard outlines and lead connections; identical with IEC 61019-3:1991
€84.58
Piezoelectric ceramic resonators; part 3: standard outlines; identical with IEC 60642-3:1992
€48.79
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999 + A1:2001 + A2:2002); German version EN 60191-4:1999 + A1:2002 + A2:2002.
Packaging of components for automatic handling - Part 1 : tape packaging of components with axial leads on continuous tapes - Amendement 1 - Emballage des composants pour opérations automatisées - Partie 1 : mise en bande des composants à sorties axiales en bandes continues.
€59.33
Structures mécaniques pour équipement électrique et électronique - Enveloppes de plein air - Partie 1 : lignes directrices pour la conception
€95.67
Structures mécaniques pour équipement électrique et électronique - Enveloppes de plein air - Partie 3 : exigences et essais d'environnement, et aspects liés à la sécurité
