Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-101 : subracks and associated plug-in units - Structures mécaniques pour équipement électronique
€125.00
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-102 : injector/extractor handle - Structures mécaniques pour équipement électronique
€90.45
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-103 : keying and alignment pin - Structures mécaniques pour équipement électronique
€98.42
Structures mécaniques pour équipements électriques et électroniques - Gestion thermique pour les armoires conformes aux séries IEC 60297 et IEC 60917 - Partie 6 : recyclage et dérivation de l'air des armoires intérieures
€91.00
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 3 : electromagnetic shielding performance tests for cabinets and subracks - Structures mécaniques pour équipement électronique
€74.67
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999
€145.14
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000
€63.27
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001); German version EN 60191-6-5:2001
€77.20
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); German version EN 60191-6-8:2001
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2022); German version EN IEC 60286-3:2022.
€167.66
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosures (IEC 61837-3:2000); German version EN 61837-3:2000.
€98.32
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001); German version EN 60191-6-6:2001
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages (IEC 60191-6-2:2001); German version EN 60191-6-2:2002
Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard (IEC 60917-1:1998 + A1:2000); German version EN 60917-1:1998 + A1:2000.
€105.42
Mechanical structures for electronic equipment - Outdoor enclosures - Part 3 : environmental requirements, tests and safety aspects - Structures mécaniques pour équipement électronique
€93.33
