Ensembles de cartes imprimées - Partie 4 : Spécification intermédiaire - Exigences pour les assemblages soudés des terminaux
€106.33
Modular order for the development of mechanical structures for electrical and electronic equipment practices - Part 1 : generic standard - Ordre modulaire pour le développement des structures mécaniques pour les infrastructures électroniques - Partie 1 : Norme générique
€116.50
Mechanical structures for electrical and electronic equipment - Outdoor enclosures - Part 1 : design guidelines
€91.00
Mechanical structures for electrical and electronic equipment - Outdoor enclosures - Part 3 : environmental requirements, tests and safety aspects - Structures mécaniques pour équipement électronique - Enveloppes de plein air - Partie 3 : Exigences environnementales, essais et aspects de la sécurité
Mechanical structures for electrical and electronic equipment - Aisle containment for IT cabinets - Part 2 : details of air flow, air separation and air cooling requirements
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-100: Basic dimensions of front panels, subracks, chassis, racks and cabinets (IEC 60297-3-100:2008); German version EN 60297-3-100:2009.
€91.03
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-105: Dimensions and design aspects for 1U high chassis (IEC 60297-3-105:2008); German version EN 60297-3-105:2009
€98.32
Modular order for the development of mechanical structures for electronic equipment practices - Part 2-3: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Extended detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units (IEC 60917-2-3:2006); German version EN 60917-2-3:2006
€116.64
Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006); German version EN 60749-39:2006.
€56.17
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-104: Connector dependent interface dimensions of subracks and plug-in units (IEC 60297-3-104:2006); German version EN 60297-3-104:2006
€84.58
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007); German version EN 60191-6-16:2007
€77.20
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2007); German version EN 60191-1:2007.
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 60191-6-13:2007); German version EN 60191-6-13:2007.
Method of evaluating the thermal performance of enclosures (IEC 62194:2005); German version EN 62194:2005
€111.40
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms
