Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 4: Combination of performance levels for modular cabinets
€88.00
Mechanical structures for electronic equipment - Outdoor enclosures - Part 2 : coordination dimensions - Structures mécaniques pour équipement électronique
€59.33
Modular order for the development of mechanical structures for electronic equipment practices - Part 2-5: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Cabinet interface dimensions for miscellaneous equipment
€127.00
Mechanical structures for electronic equipment. Dimensions of mechanical the 482,6 mm (19 in) series subracks and plug-in units, small form factor
€316.00
Instrument transformers Additional requirements for inductive voltage
Mechanical structures for electronic equipment. Outdoor enclosures Coordination dimensions
€165.00
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-107: Dimensions of subracks and plug-in units, small form factor
€286.00
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011); German version EN 60191-6-12:2011.
€98.32
Mechanical structures for electronic equipment. Tests IEC 60917 and 60297 Seismic tests cabinets racks
€193.00
Mechanical structures for electronic equipment - Outdoor enclosures - Part 2: Coordination dimensions
€22.00
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011); German version EN 60191-6-17:2011
€116.64
Mechanical structures for electronic equipment. Thermal management cabinets in accordance with IEC 60297 and 60917 series Design guide. Method the determination of forced air-cooling structure
Mechanical structures for electronic equipment - Tests for IEC 60917 and 60297 - Part 2: Seismic tests for cabinets and racks
Piezoelectric filters of assessed quality - Part 3: Standard outlines and lead connections (IEC 60368-3:2010); German version EN 60368-3:2010.
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010
€84.58
