Mechanical structures for electronic equipment - Modular order for the development of mechanical structures for electronic equipment practices - Part 2-5: Cabinet interface dimensions for miscellaneous equipment (IEC 48D/454/CD:2010)
€91.03
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 4: Combination of performance levels for modular cabinets (IEC 48D/458/CD:2010)
€69.91
Piezoelectric filters of assessed quality - Part 3: Standard outlines and lead connections (IEC 60368-3:2010); German version EN 60368-3:2010.
€98.32
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011); German version EN 60191-6-17:2011
€116.64
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2011); German version EN 61837-2:2011.
€214.30
Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 - Part 2: Design guide: Method for determination of forced air-cooling structure (IEC 48D/402/CD:2009)
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) (IEC 47D/755/CD:2009)
€105.42
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-106: Adaptation dimensions for subracks and chassis applicable with metric cabinets or racks in accordance with IEC 60917-2-1 (IEC 60297-3-106:2010); German version EN 60297-3-106:2010
Modular order for the development of mechanical structures for electronic equipment practices - Part 2-4: Sectional specification - Interface coordination dimensions for the 25 mm equipment practice - Adaptation dimensions for subracks or chassis applicable in cabinets or racks in accordance with IEC 60297-3-100 (19 in) (IEC 60917-2-4:2010); German version EN 60917-2-4:2010
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010
€84.58
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010); German version EN 60191-6-21:2010
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011); German version EN 60191-6-12:2011.
Connectors for electronic equipment - Tests and measurements - Part 2-6: Electrical continuity and contact resistance tests; Test 2f: Housing (shell) electrical continuity (IEC 60512-2-6:2002); German version EN 60512-2-6:2002.
€41.78
Quartz crystal controlled oscillators of assessed quality - Part 3: Standard outlines and lead connections (IEC 60679-3:2012); German version EN 60679-3:2013.
€111.40
Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets (IEC 62610-4:2013); German version EN 62610-4:2013
