Semiconductor devices; additional dual-in-line packages, family 50G; dimensions; identical with IEC 47(Central Office)1152
€34.30
Semiconductor devices; outline family 100G for integrated circuits; identical with IEC 47(Central Office)1150
Terms and definitions for electromechanical structures for electronic equipment; amendment 1
Semiconductor devices; coding system for packages and classification into forms of package outlines; identical with IEC 60191-4:1987
€41.78
Semiconductor devices; single ended package outline of form A; identical with IEC 47(Secretariat)1281
Semiconductor devices - Blank detail specification for reverse blocking triode thyristors, ambient and case-rated, for currents greater than 100 A; identical with IEC 47(Central Office)1305
€69.91
Quartz crystal unit outlines for automatic handling; types CU 01, CU 02, CU 03, CU 04, CU 05; identical with IEC 49(Central Office)223
€63.27
Crystal oscillator outlines types CO 23, CO 24; identical with IEC 49(Secretariat)226
Semiconductor devices - Part 7: Bipolar transistors; Section two: Blank detail specification for case-rated transistors for low-frequency amplification; Identical with IEC 60747-7-2:1989
Surface acoustic wave (SAW) filters; part 3: standard outlines (chapter IV); identical with IEC 60862-3:1986.
€77.20
Semiconductor devices - Part 6: Thyristors; Section two: Blank detail specification for bidirectional triode thyristors (triacs), ambient or case-rated, up to 100 A; Identical with IEC 60747-6-2:1991
€56.17
Mechanical structures for electronic equipment; detail standard on mechanical structrures for electronic equipment, for the 25 mm equipment practice dimensions for cabinets and racks; identical with IEC 48D(Secretariat)56
€111.40
IEC 60297-3-109:2015 Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-109: Dimensions of chassis for embedded computing devices
€186.00
IEC 62610-5:2016 Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 5: Cooling performance evaluation for indoor cabinets
€133.00
IEC 62739-2:2016 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
€93.00
