Packages for semiconductor devices; dimensioning rules Dual-in-Line packages for surface mounting (SMD); identical with IEC 47(Central Office)1012
€41.78
Packages for semiconductor devices; packages PA110 and PA111; identical with IEC 47(Central Office)1013
Packages for semiconductor devices; package A77; identical with IEC 47(Central Office)1030
Mechanical standardization; power devices, proposal for the inclusion of an additional drawing family in IEC 191-2; identical with IEC 47(Central Office)1069
€34.30
Modular plug-in unit and standard 19-inch rack mounting unit based on NIM standard (for electronic nuclear instruments)
€84.58
Mechanical standardization; terminal spacing for flat packages of integrated circuits
Revision of appendix D of IEC publication 60191-3A: design procedure for dimensions of integrated circuit packages of form 2 family
Design rules for the dimensioning of form E; surface mounted dual in line; packages with bent leads
Mechanical standardisation; dimensions of integrated circuits outlines
€48.79
Mechanical standardization; outline drawing for semiconductor laser diode devices to be included in IEC publication 60191-2
Outlines for semiconductor devices and integrated circuits; outline 5L3 and 5Q3 (IEC: A62B and A62E)
Outlines for semiconductor devices and integrated circuits; outlines 18F3 and 18G3 (IEC: A63D and A63E)
Crystal enclosure; metal, soldered; pins, type G1, outlines
Crystal enclosure; metal, soldered; wires, type N2A, outlines
Crystal enclosure; metal, welded; wires, type K4A, outlines
