Packaging of components for automatic handling surface mount on continuous tapes
€316.00
Printed board assemblies Sectional specification. Requirements for surface mount soldered
€269.00
Printed board assemblies Generic specification. Requirements for soldered electrical and electronic using surface mount related assembly technologies
€374.00
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 47D/835/CD:2013)
€84.58
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 49/1028/CD:2013)
€41.78
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 47D/834/CD:2013)
€105.42
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
€231.00
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
€325.00
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
€286.00
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosure (IEC 49/1030/CD:2013)
Surface mounted piezoelectric devices for frequency control and selection - Standard outline and terminal lead connections - Part 4: Hybrid enclosure outline (IEC 49/1031/CD:2013)
Mechanical structures for electronic equipment - Outdoor enclosures - Part 1 : design guidelines - Structures mécaniques pour équipement électronique
€95.67
Structures mécaniques pour équipement électronique - Essais pour les séries IEC 60917 et IEC 60297 - Partie 1 : exigences environnementales, montage d.essai et aspects de la sécurité des baies, bâtis, bacs à cartes et châssis dans des conditions d.intérieur
€111.67
Mechanical structures for electronic equipment - Outdoor enclosures - Part 3 : environmental requirements, tests and safety aspects - Structures mécaniques pour équipement électronique
Mechanical structures for electronic equipment. Tests IEC 60917 and 60297 series Environmental requirements, test set-up safety aspects cabinets, racks, subracks chassis under indoor conditions
