Mechanical structures for electronic equipment - Modular order for the development of mechanical structures for electronic equipment practices - Part 2-5: Cabinet interface dimensions for miscellaneous equipment (IEC 48D/454/CD:2010)
€91.03
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 4: Combination of performance levels for modular cabinets (IEC 48D/458/CD:2010)
€69.91
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 47D/769/CD:2010)
€111.40
Quartz crystal controlled oscillators of assessed quality - Part 3: Standard outlines and lead connections (IEC 49/906/CD:2010)
€116.64
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals (IEC 47D/770/CD:2010)
Mechanical structures for electronic equipment - Part 3-107: Dimensions of subracks and plug-in units, micro format (IEC 48D/429/CD:2010)
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) (IEC 47D/763/CD:2010)
€105.42
Piezoelectric devices - Preparation of outline drawings of surface mounted devices (SMD) for frequency control and selection - General rules (IEC 49/894/CD:2009)
€98.32
Packaging of components for automatic handling surface mount on continuous tapes. Type VI. Blister carrier tapes 4 mm width
€165.00
Packaging of components for automatic handling surface mount on continuous tapes. Type V. Pressed carrier tapes
€193.00
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) (IEC 47D/755/CD:2009)
Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 - Part 2: Design guide: Method for determination of forced air-cooling structure (IEC 48D/402/CD:2009)
Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard
€237.00
Mechanical structures for electronic equipment - Outdoor enclosures - Part 2: Coordination dimensions (IEC 48D/398/CD:2009)
Mechanical structures for electronic equipment - Outdoor enclosures - Part 3: Environmental requirements and tests, safety aspects (IEC 48D/399/CD:2009)
€84.58
