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DIN IEC 60191-6-5:2010-01
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) (IEC 47D/755/CD:2009)
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Summary
Mechanische Normung von Halbleiterbauelementen - Teil 6-5: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Konstruktionsleitfaden für Feinraster-Ball-Grid-Arrays (FBGA) (IEC 47D/755/CD:2009)
Notes
Prévu pour remplacer DIN EN 60191-6-5 (2002-05).
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 01/01/2010 |
| Cancellation Date | 01/01/2015 |
| Page Count | 38 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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01/01/2010
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