31.240 : Mechanical structures for electronic equipment

DIN IEC 60297-3-100:2007-06

DIN IEC 60297-3-100:2007-06

Superseded Historical

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19in) series - Part 3-100: Basic dimensions of front panels, subracks, chassis, racks and cabinets (IEC 48D/355/CD:2007)

€69.91

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BS EN 61587-1:2007

BS EN 61587-1:2007

Superseded Historical

Mechanical structures for electronic equipment. Tests IEC 60917 and 60297 Climatic, mechanical tests safety aspects cabinets, racks, subracks chassis

€269.00

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ASTM F542-07

ASTM F542-07

Withdrawn Most Recent

Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 2013)

This product is not for sale, please contact us for more information

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IEC 61760-2:2007

IEC 61760-2:2007

Superseded Historical

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

€44.00

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IEC 61587-1:2007

IEC 61587-1:2007

Superseded Historical

Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 1: Climatic, mechanical tests and safety aspects for cabinets, racks, subracks and chassis

€176.00

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DIN IEC 60191-6-14:2007-03

DIN IEC 60191-6-14:2007-03

Withdrawn Most Recent

Mechanical standardization of semiconductor devices - Part 6-14: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 47D/671/CD:2006)

€84.58

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DIN IEC 60191-6-15:2007-03

DIN IEC 60191-6-15:2007-03

Withdrawn Most Recent

Mechanical standardization of semiconductor devices - Part 6-15: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 47D/673/CD:2006)

€91.03

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DIN EN 60749-39:2007-01

DIN EN 60749-39:2007-01

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006); German version EN 60749-39:2006.

€56.17

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NF EN 61587-3, C93-471-3 (01/2007)

NF EN 61587-3, C93-471-3 (01/2007)

Superseded Historical

Structures mécaniques pour équipement électronique - Essais pour la IEC 60917 et la IEC 60297 - Partie 3 : essais de performance du blindage électromagnétique pour les baies, les bâtis et les bacs à cartes

€95.67

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BS EN 61587-3:2006

BS EN 61587-3:2006

Superseded Historical

Mechanical structures for electronic equipment. Tests IEC 60917 and 60297 Electromagnetic shielding performance tests cabinets, racks sub-racks

€193.00

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BS EN 61760-1:2006

BS EN 61760-1:2006

Superseded Historical

Surface mounting technology Standard method for the specification of surface components (SMDs)

€316.00

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IEC 61587-3:2006

IEC 61587-3:2006

Superseded Historical

Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 3: Electromagnetic shielding performance tests for cabinets, racks and subracks

€88.00

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IEC 61760-1:2006

IEC 61760-1:2006

Superseded Historical

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

€231.00

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DIN IEC 61587-1:2006-02

DIN IEC 61587-1:2006-02

Superseded Historical

Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 1: Climatic, mechanical tests and safety aspects for cabinets, racks and subracks (IEC 48D/325/CD:2005)

€105.42

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DIN EN 60191-6-13:2005-07

DIN EN 60191-6-13:2005-07

Superseded Historical

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top type socket for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 47D/620/CDV:2005); German version prEN 60191-6-13:2005

€84.58

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