Packaging of components for automatic handling - Part 2: Packaging of components with unidirectional leads on continuous tapes
€286.00
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 47D/708/CD:2007)
€122.34
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage (IEC 47D/709/CD:2007)
€111.40
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2007); German version EN 60191-1:2007.
€116.64
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 1: Climatic, mechanical tests and safety aspects for cabinets, racks, subracks and chassis (IEC 61587-1:2007); German version EN 61587-1:2007.
€105.42
Mechanical standardization of semiconductor devices - Part 6 : General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 47D/694/CD:2007)
€128.22
Packaging of components for automatic handling surface mount on continuous tapes
€269.00
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 -- Part 1: Climatic, mechanical tests and safety aspects for cabinets, racks, subracks and chassis (IEC 61587-1:2007).
€78.00
Mechanical standardization of semiconductor devices - Part 6-17: Design Guide for Stacked Packages and Individual Stackable packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array Packages (FBGA/FLGA) (IEC 47D/690/CD:2007)
Explosive atmospheres Equipment repair, overhaul and reclamation
€374.00
Structures mécaniques pour équipement électronique - Essais pour la IEC 60917 et la IEC 60297 - Partie 1 : essais climatiques, mécaniques et aspects de la sécurité des baies, bâtis, bacs à cartes et châssis
€111.67
Surface mounting technology Transportation and storage conditions of surface devices (SMD). Application guide
€165.00
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
€231.00
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 3: Electromagnetic shielding performance tests for cabinets, racks and subracks (IEC 61587-3:2006); German version EN 61587-3:2006.
€77.20
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19in) series - Part 3-105: Dimensions and design aspects for 1U chassis (IEC 48D/354/CD:2007)
€69.91
