Superseded
Draft standard
Historical
DIN IEC 60191-6-17:2007-10
Mechanical standardization of semiconductor devices - Part 6-17: Design Guide for Stacked Packages and Individual Stackable packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array Packages (FBGA/FLGA) (IEC 47D/690/CD:2007)
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Summary
Mechanische Normung von Halbleiterbauelementen - Teil 6-17: Konstruktionsleitfaden für gestapelte Gehäuse und individuell stapelbare Gehäuse - Feinraster-Ball-Grid-Array und Feinraster-Land-Grid-Array (FBGA/FLGA) (IEC 47D/690/CD:2007)
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 10/01/2007 |
| Page Count | 8 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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