Semiconductor devices, mechanical standardization - Common package unit design guide for packages with gull-wing lead (IEC 47D/255/CDV:1998)
€48.79
Semiconductor devices, mechanical standardization - Tape ball grid array 0,75 mm ball diameter family (IEC 47D/256/CDV:1998)
€69.91
P-FBGA (Plastic Fine pitch Ball Grid Array), 0,5 mm (IEC 47D/315A/CD:1999)
€288.60
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 47D/392/CDV:2000); German version prEN 60191-6:2000
€116.64
Mechanical standardization for semiconductor devices - Small Outline J-Lead package (SOJ) 0,80 mm pitch (IEC 47D/411/CDV); German version prEN 60191-2-46:2001
€41.78
Mechanical standardization for semiconductor devices - Plastic enhanced, low profile quad flatpack (HLQFP) - Outline family, heat slug up, L-PQFP-G (IEC 47D/410/CDV:2001); German version prEN 60191-2-49:2001
€84.58
Mechanical standardization for semiconductor devices - Plastic low profile quad flatpack (HLQFP) - Outline family, heat slug down (IEC 47D/407/CDV:2000); German version prEN 60191-2-50:2000
Mechanical standardization of semiconductor devices - Plastic enhanced thin profile quad flatpack (HTQFP) - Outline family, heat slug up T-PQFP-G (IEC 47D/418/CDV:2001); German version prEN 60191-2-51:2001
Mechanical standardization for semiconductor devices - Plastic enhanced thin profile quad flatpack (HTQFP) - Outline family, heat slug down (IEC 47D/408/CDV:2001); German version prEN 60191-2-52:2001
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19-in) series - Part 3-101: Subracks and associated plug-in units (IEC 48D/255/CD:2000)
€105.42
General rules for the dimensions of P-VSON (IEC 47D/422/CDV:2001); German version prEN 60191-6-10:2001
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19-in) series - Part 3-102: Injector/extractor handle (IEC 48D/256/CD:2000)
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19-in) series - Part 3-103: Keying and alignment pin (IEC 48D/257/CD:2000)
General design guideline for rectangular FLGA packages (IEC 47D/395/CDV:2000); German version prEN 60191-6-12:2000
€98.32
Dual-In-Line memory module family, 184 Pin DDR, 1,27 mm contact center package (IEC 47D/393/CDV:2000)
