Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types) (IEC 91/752/CD:2008)
€128.22
Méthodes d'essais pour les matériaux électriques, les structures d'interconnexion et les ensembles - Partie 6 : méthodes d'essais pour les matériaux utilisés dans la fabrication des assemblages électroniques
€138.00
Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 91/753/CD:2008)
€111.40
Quality Assessment Systems - Part 3: Selection and use of sampling plans for Printed Board and Laminate end-product and in-process auditing (IEC 91/749/CD:2008)
€190.65
Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 91/744/CD:2007)
€105.42
Information technology equipment. Immunity characteristics. Limits and methods of measurement
€316.00
Explosive atmospheres Equipment protection by powder filling "q"
€269.00
Mechanical standardization of semiconductor devices Design guideline open-top-type sockets for fine-pitch ball grid array and land (FBGA/FLGA)
€193.00
Insulation coordination for equipment within low-voltage systems - Part 5 : comprehensive method for determining clearances and creepage distances equal to or less than 2 mm
€153.00
Evaluation criteria for voids in soldered joints of BGA and LGA (IEC 91/707/CD:2007)
€116.64
Printed board and printed board assemblies - Design and use - Part 7: Sectional requirements - Electronic component zero orientation for CAD library construction (IEC 91/701/CDV:2007); German version prEN 61188-7:2007
€91.03
Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - AC semiconductor controllers and contactors for non-motor loads
€76.00
Materials for printed boards and other interconnecting structures - Part 2-31: Reinforced base materials clad and unclad for high frequency application - Halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 4.1 at 1 GHz) and flammability (vertical burning test), copper-clad (IEC 91/671/CDV:2007); German version prEN 61249-2-31:2007
€98.32
Materials for printed boards and other interconnecting structures - Part 2-32: Reinforced base materials clad and unclad for high frequency application - Halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 3.7 at 1 GHz) and flammability (vertical burning test), copper-clad (IEC 91/673/CDV:2007); German version prEN 61249-2-32:2007
Materials for printed boards and other interconnecting structures - Part 2-33: Reinforced base materials clad and unclad for high frequency application - Non-halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 4.1 at 1 GHz) and flammability (vertical burning test), copper-clad (IEC 91/675/CDV:2007); German version prEN 61249-2-33:2007
