IEEE Standard for Space Applications Module, Extended Height Format E Form Factor
€149.00
IEEE Standard Test Access Port and Boundary-Scan Architecture
IEEE Standard Test Access Port and Boundary Scan Architecture
€157.00
IEEE Standard for a Mixed-Signal Test Bus
€135.00
IEEE Standard for In-System Configuration of Programmable Devices
€131.00
IEC 62496-1:2008 Optical circuit boards - Part 1: General
€186.00
IEC 61249-2-33:2009 Materials for printed boards and other interconnecting structures - Part 2-33: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad
IEC 61249-2-31:2009 Materials for printed boards and other interconnecting structures - Part 2-31: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad
IEC 61249-2-34:2009 Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad
IEC 61249-2-32:2009 Materials for printed boards and other interconnecting structures - Part 2-32: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad
IEC 61191-6:2010 Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
€302.00
IEC 61249-2-41:2010 Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
IEC 61249-2-42:2010 Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
IEC 60947-4-3:1999+AMD1:2006+AMD2:2011 (Consolidated version) Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - AC semiconductor controllers and contactors for non-motor loads
€1,218.00
An adhesion evaluation method for microcircuits on PCB (Printed Circuit Board) by scratch test
€77.00
