Test methods for electrical materials, interconnection structures and assemblies - Part 11: Measurement of melting temperature and melting temperature ranges of solder alloys (IEC 91/879/CD:2009)
€69.91
Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad (IEC 91/895/CD:2009)
€111.40
Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad (IEC 91/890/CD:2009)
€105.42
Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 91/896/CD:2009)
Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High Performance, modified, non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 91/889/CD:2009)
Printed boards and printed board assemblies. Design use Electronic component zero orientation for CAD library construction
€269.00
Corrigendum 1 - Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
€0.00
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
€127.00
Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts
This product is not for sale, please contact us for more information
Industrial communication networks. Fieldbus specifications Application layer protocol specification. Type 3 elements
€404.00
Industrial communication networks. Fieldbus specifications Application layer protocol specification. Type 4 elements
€316.00
Méthodes d'essais pour les matériaux électriques, les structures d'interconnexion et les ensembles - Partie 5 : méthodes d'essais pour les cartes imprimées équipées
€184.00
Printed boards - Part 7-1: Performance guide for single- and double-sided flexible printed boards (IEC 91/751/CD:2008)
€157.10
