Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials clad and unclad for high frequency application - Non-halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 3.7 at 1 GHz) and flammability (vertical burning test), copper-clad (IEC 91/677/CDV:2007); German version prEN 61249-2-34:2007
€98.32
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials clad and unclad - Modified epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 91/655/CDV:2007); German version prEN 61249-2-35:2007
€105.42
Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 91/657/CDV:2007); German version prEN 61249-2-36:2007
Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 91/659/CDV:2007); German version prEN 61249-2-37:2007
Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials clad and unclad - Non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 91/661/CDV:2007); German version prEN 61249-2-38:2007
Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 91/663/CDV:2007); German version prEN 61249-4-14:2007
€63.27
Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 91/665/CDV:2007); German version prEN 61249-4-15:2007
€69.91
Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 91/667/CDV:2007); German version prEN 61249-4-16:2007
Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 91/669/CDV:2007); German version prEN 61249-4-17:2007
Printed board assembly products. Manufacturing description data and transfer methodology Generic requirements
€404.00
Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
€286.00
Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
This product is not for sale, please contact us for more information
Performance guide for single- and double-sided flexible printed wiring boards
€325.00
Printed board design, manufacture and assembly - Terms and definitions (IEC 60194:2006); German version EN 60194:2006, text in English
€261.78
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
€1,012.00
