MATERIALS FOR INTERCONNECTION STRUCTURES. PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH OR WITHOUT COATINGS. SECTION 4: CONDUCTIVE INKS.
€62.00
MATERIALS FOR INTERCONNECTION STRUCTURES. PART 7: SECTIONAL SPECIFICATION SET FOR RESTRAINING CORE MATERIALS. SECTION 1: COPPER/INVAR/COPPER.
€47.00
MATERIALS FOR INTERCONNECTION STRUCTURES. PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS. SECTION 7: MARKING LEGEND INKS.
€69.00
PRINTED BOARDS. PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS. SECTIONAL SPECIFICATION.
€86.00
PRINTED BOARDS. PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION. SECTION 1: CAPABILITY DETAIL SPECIFICATION - PERFORMANCE LEVELS A, B, AND C
€116.00
Materials for printed boards and other interconnecting structures -- Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core / woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad
€0.00
Materials for printed boards and other interconnecting structures -- Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Materials for printed boards and other interconnecting structures -- Part 2-10: Reinforced base materials, clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Materials for printed boards and other interconnecting structures -- Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
ELECTROTECHNICAL VOCABULARY. PRINTED CIRCUITS.
€50.00
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad (IEC 61249-2-51:2023); German version EN IEC 61249-2-51:2023
€98.32
Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies (IEC 61193-1:2001); German version EN 61193-1:2002
Materials for printed boards and other interconnecting structures - Part 2-19: Reinforced base materials, clad and unclad; Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined flammability (vertical burning test), copper clad (IEC 61249-2-19:2001); German version EN 61249-2-19:2002
€91.03
Materials for printed boards and other for interconnecting structures - Part 2-4: Reinforced base materials, clad and unclad; Polyester non-wowen/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad (IEC 61249-2-4:2001); German version EN 61249-2-4:2002
Materials for printed boards and other interconnecting structures - Part 2-18: Reinforced base materials clad and unclad; Polyester non-woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad (IEC 61249-2-18:2002); German version EN 61249-2-18:2002
