31.180 : Printed circuits and boards

DIN IEC/TS 62326-16*DIN SPEC 42326-16:2013-07

DIN IEC/TS 62326-16*DIN SPEC 42326-16:2013-07

Withdrawn Most Recent

Printed boards - Part 16: Device Embedded Substrate Technology - Generics (IEC 91/1081/CD:2013)

€98.13

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DIN IEC/TS 62326-17*DIN SPEC 42326-17:2013-07

DIN IEC/TS 62326-17*DIN SPEC 42326-17:2013-07

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Printed boards - Part 17: Device embedded substrates - TEG (test element group) (IEC 91/1082/CD:2013)

€102.52

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DIN EN 62326-18:2013-07

DIN EN 62326-18:2013-07

Superseded Historical

Printed boards - Part 18: Standard on Device Embedded Substrate - Test methods (IEC 91/1083/CD:2013)

€128.22

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DIN EN 61189-5-4:2013-07

DIN EN 61189-5-4:2013-07

Superseded Historical

Test methods for electrical materials, interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies: Solder alloys and fluxed and non-fluxed solid wire (IEC 91/1072/CD:2012)

€98.32

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IEEE 1149.1:2013

IEEE 1149.1:2013

Withdrawn Most Recent

IEEE Standard for Test Access Port and Boundary-Scan Architecture

€310.00

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DIN EN 61191-2:2013-05

DIN EN 61191-2:2013-05

Superseded Historical

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 91/1091/FDIS:2013); German version FprEN 61191-2:2013

€116.64

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DIN EN 61189-5-2:2013-04

DIN EN 61189-5-2:2013-04

Superseded Historical

Test methods for electrical materials, interconnection structures and assemblies - Part 5-2: Test methods for printed board assemblies: Soldering Flux (IEC 91/1070/CD:2012)

€145.14

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DIN EN 61191-1:2013-04

DIN EN 61191-1:2013-04

Superseded Historical

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 91/1089/FDIS:2013); German version FprEN 61191-1:2013

€150.65

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ASTM D5109-12

ASTM D5109-12

Withdrawn Most Recent

Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards (Withdrawn 2020)

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NF EN 61182-2-2, C93-791-2-2 (10/2012)

NF EN 61182-2-2, C93-791-2-2 (10/2012)

Withdrawn Most Recent

Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2 : sectional requirements for implementation of printed board fabrication data description - Produits pour cartes imprimées équipées

€153.00

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IEEE 1149.8.1:2012

IEEE 1149.8.1:2012

Withdrawn Most Recent

IEEE Standard for Boundary-Scan-Based Stimulus of Interconnections to Passive and/or Active Components

€103.00

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NF EN 60603-7/A1, C93-430-7/A1 (08/2012)

NF EN 60603-7/A1, C93-430-7/A1 (08/2012)

Superseded Historical

Connectors for electronic equipment - Part 7 : detail specification for 8-way, unshielded, free and fixed connectors

€59.33

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IEC 61182-2-2:2012

IEC 61182-2-2:2012

Withdrawn Most Recent

Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description

€325.00

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DIN EN 62326-20:2012-02

DIN EN 62326-20:2012-02

Superseded Historical

Printed boards - Part 20: Electronic circuit board for high-brightness LEDs (IEC 91/1007/CD:2011)

€140.00

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DIN EN 62326-15:2012-01

DIN EN 62326-15:2012-01

Superseded Historical

Printed boards - Device Embedded Substrate - General electrical test guide for device embedded substrate with active devices, passive components (Capacitor, Resistor, Inductor, etc), Integrated passive device (IPD), and discrete packages (IEC 91/995/CD:2011)

€105.42

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