IEC 63251:2023 Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
€186.00
Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements; controlled impedance (IEC 61188-1-2:1998); German version EN 61188-1-2:1998
€105.42
Printed board assemblies - Part 1: Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:1998); German version EN 61191-1:1998.
€111.40
Printed board assemblies - Part 2: Sectional specification: Requirements for surface mount soldered assemblies (IEC 61191-2:1998); German version EN 61191-2:1998.
€98.32
Printed board assemblies - Part 3: Sectional specification: Requirements for through-hole mount soldered assemblies (IEC 61191-3:1998); German version EN 61191-3:1998.
€77.20
Printed board assemblies - Part 4: Sectional specification: Requirements for terminal soldered assemblies (IEC 61191-4:1998); German version EN 61191-4:1998.
€63.27
IEC 60050-541:1990 International Electrotechnical Vocabulary (IEV) - Part 541: Printed circuits
€93.00
IEC 61189-5-504:2020 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)
IEC 61189-5-501:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes
€133.00
IEC 61189-5-502:2021 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assemblies
IEC 61189-5-601:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
€302.00
IEC 60194-1:2021 Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies
€551.00
IEC 61188-6-2:2021 Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
IEC 61188-6-1:2021 Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
IEC 61189-5-301:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles
