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IEC 61189-5:2006
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
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Summary
IEC 61189-5:2006 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 08/29/2006 |
| Release Date | 08/29/2006 |
| Cancellation Date | 03/29/2024 |
| Edition | 1 |
| Page Count | 122 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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