IEC 60749-5:2017 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
€46.00
IEC 60747-16-4:2004/AMD2:2017 Amendment 2 - Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
€12.00
IEC 60747-16-3:2002/AMD2:2017 Amendment 2 - Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
IEC 62880-1:2017 Semiconductor devices - Stress migration test standard - Part 1: Copper stress migration test standard
€186.00
IEC 62047-30:2017 Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
€133.00
IEC 60747-16-3:2002 Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
€302.00
IEC 61975:2010 High-voltage direct current (HVDC) installations - System tests
€441.00
IEC 60821:1991/AMD1:1999 Amendment 1 - VMEbus - Microprocessor system bus for 1 byte to 4 byte data
IEC 60191-6-3:2000 Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
IEC 60747-14-2:2000 Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements
€93.00
IEC 60191-6-6:2001 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
IEC 60747-16-2:2001 Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers
€244.00
IEC 60191-6-5:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
IEC 60191-6-8:2001 Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
IEC 60191-6-1:2001 Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
€23.00
