31.080 : Semiconductor devices

31.080.01

Semiconductor devices in general

31.080.10

Diodes

31.080.20

Thyristors

31.080.30

Transistors

31.080.99

Other semiconductor devices
IEC 60747-18-2:2020

IEC 60747-18-2:2020

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IEC 60747-18-2:2020 Semiconductor devices - Part 18-2: Semiconductor bio sensors - Evaluation process of lens-free CMOS photonic array sensor package modules

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IEC 60191-2:1966/AMD21:2020

IEC 60191-2:1966/AMD21:2020

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IEC 60191-2:1966/AMD21:2020 Amendment 21 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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IEC 62899-503-1:2020

IEC 62899-503-1:2020

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IEC 62899-503-1:2020 Printed electronics - Part 503-1: Quality assessment - Test method of displacement current measurement for printed thin-film transistor

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IEC 60747-5-5:2020

IEC 60747-5-5:2020

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IEC 60747-5-5:2020 Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers

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IEC 60747-16-5:2013/AMD1:2020

IEC 60747-16-5:2013/AMD1:2020

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IEC 60747-16-5:2013/AMD1:2020 Amendment 1 - Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators

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IEC 60747-17:2020

IEC 60747-17:2020

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IEC 60747-17:2020 Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation

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IEC 60747-16-5:2013/AMD1:2020/COR1:2020

IEC 60747-16-5:2013/AMD1:2020/COR1:2020

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IEC 60747-16-5:2013/AMD1:2020/COR1:2020 Corrigendum 1 - Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators

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IEC 62047-28:2017

IEC 62047-28:2017

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IEC 62047-28:2017 Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices

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IEC 62047-27:2017

IEC 62047-27:2017

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IEC 62047-27:2017 Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

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IEC 62951-1:2017

IEC 62951-1:2017

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IEC 62951-1:2017 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates

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IEC 60749-3:2017

IEC 60749-3:2017

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IEC 60749-3:2017 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

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IEC 60749-4:2017

IEC 60749-4:2017

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IEC 60749-4:2017 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)

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IEC 60749-6:2017

IEC 60749-6:2017

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IEC 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature

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IEC 60749-9:2017

IEC 60749-9:2017

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IEC 60749-9:2017 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking

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IEC 60749-28:2017

IEC 60749-28:2017

Superseded Historical

IEC 60749-28:2017 Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level

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