31.080 : Semiconductor devices

31.080.01

Semiconductor devices in general

31.080.10

Diodes

31.080.20

Thyristors

31.080.30

Transistors

31.080.99

Other semiconductor devices
IEC 60191-4:1999/AMD2:2002

IEC 60191-4:1999/AMD2:2002

Superseded Historical

Amendment 2 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

€11.00

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DIN EN 60747-16-1:2002-07

DIN EN 60747-16-1:2002-07

Superseded Historical

Semiconductor devices - Part 16-1: Microwave integrated circuits; Amplifiers (IEC 60747-16-1:2001); German version EN 60747-16-1:2002.

€134.02

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NF EN 62148-1, C93-883-1 (07/2002)

NF EN 62148-1, C93-883-1 (07/2002)

Superseded Historical

Composants et dispositifs actifs en fibres optiques - Normes de boîtier et d'interface - Partie 1 : généralités et lignes directrices

€59.33

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BS 6493-1.4:1992

BS 6493-1.4:1992

Superseded Historical

Semiconductor devices. Discrete devices Recommendations for microwave diodes and transistors

€404.00

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IEC 60191-6-12:2002

IEC 60191-6-12:2002

Superseded Historical

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type

€127.00

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DIN EN 60749-5:2002-06

DIN EN 60749-5:2002-06

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady state temperature humidity bias life test (IEC 47/1600/CDV:2002); German version prEN 60749-5:2002

€48.79

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DIN IEC 60749-21:2002-06

DIN IEC 60749-21:2002-06

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 47/1591/CD:2001)

€84.58

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DIN EN 60749-1:2002-06

DIN EN 60749-1:2002-06

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - General (IEC 47/1571/CDV:2001); German version prEN 60749-1:2001

€41.78

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NF EN 60749/A2, C96-022/A2 (06/2002)

NF EN 60749/A2, C96-022/A2 (06/2002)

Withdrawn Most Recent

Dispositifs à semiconducteurs - Essais mécaniques et climatiques

€114.00

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IEC 60747-5-1:1997+AMD1:2001+AMD2:2002 Consolidated

IEC 60747-5-1:1997+AMD1:2001+AMD2:2002 Consolidated

Superseded Historical

Discrete semiconductor devices and integrated circuits - Part 5-1: Optoelectronic devices - General

€451.00

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DIN EN 60749-15:2002-05

DIN EN 60749-15:2002-05

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 47/1583/CDV:2001); German version prEN 60749-15:2001

€41.78

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DIN EN 60749-16:2002-05

DIN EN 60749-16:2002-05

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) test (IEC 47/1584/CDV:2001); German version prEN 60749-16:2001

€41.78

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DIN EN 60749-17:2002-05

DIN EN 60749-17:2002-05

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation (IEC 47/1588/CDV:2001); German version prEN 60749-17:2001

€41.78

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DIN EN 60749-18:2002-05

DIN EN 60749-18:2002-05

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionising Radiation (total dose); Test procedure (IEC 47/1589/CDV:2001); German version prEN 60749-18:2001

€69.91

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DIN EN 60749-19:2002-05

DIN EN 60749-19:2002-05

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test (IEC 47/1590/CDV:2001); German version prEN 60749-19:2001

€41.78

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