Superseded
Standard
Historical
IEC 60191-6-12:2002
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type
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Summary
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 06/14/2002 |
| Release Date | 06/14/2002 |
| Cancellation Date | 06/08/2011 |
| Edition | 1 |
| Page Count | 20 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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