Semiconductor devices - Micro-electromechanical devices - Part 10: Micropillar compression test for MEMS materials (IEC 47F/48/CD:2010)
€69.91
Semiconductor devices - Micro electro mechanical devices - Part 13: Bend- and shear- test methods of measuring adhesive strength for MEMS structures (IEC 47F/44/CD:2010)
Semiconductor devices - Discrete devices - Part 7-5: Bipolar transistors (BTRs) for power switching applications (IEC 47E/234/CD:2002)
€111.40
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 47/1682/CD:2003)
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003); German version EN 60749-19:2003 + Corrigendum 2003-06.
€41.78
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2003); German version EN 60749-15:2003.
€56.17
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2002 + Corr. 1:2003); German version EN 60749-20:2003.
€98.32
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) (IEC 60749-32:2003 + Corr. 1:2003); German version EN 60749-32:2003 + Corr.:2003.
Semiconductor devices - Part 1: Microelectromechanical devices; Terms and definitions (IEC 47/1695A/CD:2003)
Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing; Machine model (MM) (IEC 47/1624/CDV:2002); German version prEN 60749-27:2002
€63.27
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing; Human body model (HBM) (IEC 47/1623/CDV:2002); German version prEN 60749-26:2002
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 47/1615/CDV:2002); German version prEN 60749-14:2002
Semiconductor devices - Mechanical and climatic test methods - Part 25: Rapid change of temperature (air, air) (IEC 47/1616/CDV:2002); German version prEN 60749-25:2002
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test (IEC 47/1625/CDV:2002); German version prEN 60749-29:2002
€91.03
Discrete semiconductor devices - Part 14-4: Semiconductor accelerometers (IEC 47E/220/CD:2002).
€248.22
