31.080.01 : Semiconductor devices in general

UNE-EN 60749-19:2003/A1:2011

UNE-EN 60749-19:2003/A1:2011

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Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength

€32.00

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UNE-EN 60749-32:2004/A1:2011

UNE-EN 60749-32:2004/A1:2011

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Semiconductor devices - Mechanical and climatic test methods -- Part 32: Flammability of plastic-encapsulated devices (externally induced)

€36.00

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DIN EN 60749-19:2011-01

DIN EN 60749-19:2011-01

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Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003 + A1:2010); German version EN 60749-19:2003 + A1:2010.

€56.17

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DIN EN 60749-32:2011-01

DIN EN 60749-32:2011-01

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Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) (IEC 60749-32:2002 + Cor. :2003 + A1:2010); German version EN 60749-32:2003 + Cor. :2003 + A1:2010.

€56.17

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BS EN 60191-6-20:2010

BS EN 60191-6-20:2010

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Mechanical standardization of semiconductor devices General rules for the preparation outline drawings surface mounted device packages. Measuring methods package dimensions small J-lead packages (SOJ)

€193.00

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BS EN 60191-6-21:2010

BS EN 60191-6-21:2010

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Mechanical standardization of semiconductor devices General rules for the preparation outline drawings surface mounted device packages. Measuring methods package dimensions small packages (SOP)

€193.00

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DIN EN 62415:2010-12

DIN EN 62415:2010-12

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Semiconductor devices - Constant current electromigration test (IEC 62415:2010); German version EN 62415:2010

€77.20

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DIN EN 62418:2010-12

DIN EN 62418:2010-12

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Semiconductor devices - Metallization stress void test (IEC 62418:2010); German version EN 62418:2010

€98.32

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IEC 60749-19:2003+AMD1:2010 Consolidated

IEC 60749-19:2003+AMD1:2010 Consolidated

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Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

€55.00

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IEC 60749-32:2002+AMD1:2010 Consolidated

IEC 60749-32:2002+AMD1:2010 Consolidated

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Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

€55.00

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NF EN 62415, C80-201 (11/2010)

NF EN 62415, C80-201 (11/2010)

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Dispositifs à semiconducteurs - Essai d'électromigration en courant constant

€77.67

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NF EN 60191-6-19, C96-013-6-19 (11/2010)

NF EN 60191-6-19, C96-013-6-19 (11/2010)

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Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-19 : méthodes de mesure du gauchissement des boîtiers à température élevée et du gauchissement maximum admissible

€95.67

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BS EN 60749-19:2003+A1:2010

BS EN 60749-19:2003+A1:2010

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Semiconductor devices. Mechanical and climatic test methods Die shear strength

€165.00

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BS EN 60191-6-18:2010

BS EN 60191-6-18:2010

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Mechanical standardization of semiconductor devices General rules for the preparation outline drawings surface mounted device packages. Design guide ball grid array (BGA)

€269.00

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IEC 60749-34:2010

IEC 60749-34:2010

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Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling

€44.00

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