Semiconductor devices. Mechanical and climatic test methods Solderability
€269.00
Semiconductor devices. Mechanical and climatic test methods Latch-up
Mechanical standardization of semiconductor devices General rules for the preparation outline drawings surface mounted device packages. Design guidelines fine-pitch land grid array (FLGA)
Semiconductor devices - Mechanical and climatic test methods - Part 19 : die shear strength - Dispositifs à semiconducteurs
€43.67
Electrostatic discharge sensitivity testing. Transmission line pulse (TLP). Component level
Semiconductor devices Generic specification for discrete and integrated circuits
€316.00
Semiconductor devices - Mechanical and climatic test methods -- Part 34: Power cycling
€61.00
Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
€176.00
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 60749-23:2004 + A1:2011); German version EN 60749-23:2004 + A1:2011.
€77.20
Mechanical standardization of semiconductor devices General rules for the preparation outline drawings surface mounted device packages. Design guide stacked Fine-pitch ball grid array and fine-pitch land (P-PFBGA P-PFLGA)
Semiconductor devices. Mechanical and climatic test methods High temperature operating life
€165.00
Semiconductor devices Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
€193.00
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
€127.00
Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers (IEC 62374-1:2010); German version EN 62374-1:2010 + AC:2011
€98.32
Dispositifs à semiconducteurs - Partie 1 : essai de rupture diélectrique en fonction du temps (TDDB) pour les couches intermétalliques
€111.67
