Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 6 : méthodes d'essais de fatigue axiale des matériaux en couche mince
€95.67
Semiconductor devices. Metallization stress void test
€193.00
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
€44.00
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
€88.00
Semiconductor devices - Part 1: General
€567.00
Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-18 : règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface - Guide de conception pour les boîtiers matriciels à billes (BGA)
€82.00
Semiconductor devices General
€355.00
Semiconductor devices. Constant current electromigration test
€165.00
High-voltage direct current (HVDC) installations - System tests
€418.00
Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
€11.00
Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
€0.00
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009); German version EN 62047-6:2010
€98.32
Mechanical standardization of semiconductor devices Measurement methods the package warpage at elevated temperature and maximum permissible
Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
