Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013); German version EN 62047-18:2013
€91.03
Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices
€374.00
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
€176.00
€325.00
BS EN 60191-1. Mechanical standardization of semiconductor devices. Part 1. General rules for the preparation of outline drawings of discrete devices
€23.00
Mechanical standardization of semiconductor devices - Part 6-22 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (SFBGA and S-FLGA)
€82.00
Semiconductor devices - Discrete devices - Part 15 : isolated power semiconductor devices - Dispositifs à semi-conducteurs
€93.67
BS EN 60191-6-16. Mechanical standardization of semiconductor devices. Part 6-16. Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Mechanical standardization of semiconductor devices General rules for the preparation outline drawings surface mounted device packages. Design guide packages Silicon Fine-pitch Ball Grid Array and Land (S-FBGA S-FLGA)
€193.00
Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (IEC 60749-27:2006 + A1:2012); German version EN 60749-27:2006 + A1:2012.
Semiconductor devices - Mechanical and climatic test methods - Part 27 : electrostatic discharge (ESD) sensivity testing - Machine model (MM) - Dispositifs à semiconducteurs
€43.67
Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Machine model (MM)
Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-16 : glossaire des supports de test et de déverminage pour les BGA, LGA, FBGA et FLGA
€77.67
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
€127.00
Amendment 19 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
