Electronic components - Long-term storage of electronic semiconductor devices - Part 1 : general
€107.33
Electronic components - Long-term storage of electronic semiconductor devices - Part 2 : deterioration mechanisms
€111.67
Semiconductor devices - Mechanical and climatic test methods - Part 3 : external visual examination
€52.00
Semiconductor devices - Mechanical and climatic test methods - Part 4 : Damp Heat, steady state, highly accelerated stress test (HAST)
€77.67
Semiconductor devices - Mechanical and climatic test methods - Part 6 : storage at high temperature
€37.33
Semiconductor devices - Mechanical and climatic test methods - Part 9 : permanence of marking
Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 5 - dispositifs de puces et plaquettes
Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (IEC 60749-44:2016); German version EN 60749-44:2016
€105.42
High-voltage direct current (HVDC) installations - System tests
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
€44.00
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
€22.00
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
Mechanical standardization of semiconductor devices - Part 6-13 : design guideline of open-top-type sockets for fine-pitch ball grid array (FBGA) and fine-pitch land grid array (FLGA)
€95.67
Mechanical standardization of semiconductor devices Design guideline open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Land (FLGA)
€269.00
