29.045 : Semiconducting materials

DIN 50433-1:1976-12

DIN 50433-1:1976-12

Withdrawn Most Recent

Testing of semi-conducting inorganic materials; determining the orientation of single crystals by means of X-ray diffraction

€24.39

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DIN 50436:1976-10

DIN 50436:1976-10

Withdrawn Most Recent

Testing of semi-conducting inorganic materials - Measurement of the metalurgic thickness of epitaxial layers of silicon by the stacking fault method

€24.39

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DIN 50437:1979-06

DIN 50437:1979-06

Withdrawn Most Recent

Testing of semi-conductive inorganic materials; measuring the thickness of silicon epitaxial layer thickness by infrared interference method

€34.30

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DIN 50433-2:1976-12

DIN 50433-2:1976-12

Withdrawn Most Recent

Testing of semi-conducting inorganic materials; determining the orientation of single crystals by means of optical reflection figure

€24.39

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DIN 50451-4:2024-09

DIN 50451-4:2024-09

Active Most Recent

Testing of materials for semiconductor technology - Determination of trace elements in liquids - Part 4: Determination of 34 elements in ultra pure water by mass spectrometry with inductively coupled plasma (ICP-MS)

€69.91

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DIN 50450-1:1987-08

DIN 50450-1:1987-08

Withdrawn Most Recent

Testing of materials for semiconductor technology; determination of impurities in carrier gases and doping gases; determination of water impurity in hydrogen, oxygen, nitrogen, argon and helium by using a diphosphorus pentoxide cell

€34.30

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NF EN 62047-9, C96-050-9 (04/2012)

NF EN 62047-9, C96-050-9 (04/2012)

Active Most Recent

Semiconductor devices - Micro-electromechanical devices - Part 9 : wafer to wafer bonding strength measurement for MEMS - Dispositifs à semiconducteurs

€111.67

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DIN 50451-4:2024-01

DIN 50451-4:2024-01

Superseded Historical

Testing of materials for semiconductor technology - Determination of trace elements in liquids - Part 4: Determination of 34 elements in ultra pure water by mass spectrometry with inductively coupled plasma (ICP-MS)

€69.91

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IEC 60146-1-1:2009

IEC 60146-1-1:2009

Superseded Historical

IEC 60146-1-1:2009 Semiconductor converters - General requirements and line commutated converters - Part 1-1: Specification of basic requirements

€470.00

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IEC 60146-1-1:2024

IEC 60146-1-1:2024

Active Most Recent

IEC 60146-1-1:2024 Semiconductor converters - General requirements and line commutated converters - Part 1-1: Specification of basic requirements

€470.00

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DIN 50455-2:1999-11

DIN 50455-2:1999-11

Active Most Recent

Testing of materials for semiconductor technology - Methods for the characterisation photoresists - Part 2: Determination of photosensitivity of positive photoresists

€34.30

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DIN 50457-2:1999-11

DIN 50457-2:1999-11

Withdrawn Most Recent

Testing of materials for semiconductor technology - Determination of the volume fraction of components in dopant gas mixtures by wet-chemical methods - Part 2: Phosphine in nitrogen phosphine mixtures

€34.30

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DIN 50457-1:1999-11

DIN 50457-1:1999-11

Withdrawn Most Recent

Testing of materials for semiconductor technology - Determination of the volume fraction of components in dopant gas mixtures by wet-chemical methods - Part 1: Diborane in hydrogen diborane mixtures

€34.30

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DIN 50441-5:2001-04

DIN 50441-5:2001-04

Withdrawn Most Recent

Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 5: Terms of shape and flatness deviation

€56.17

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DIN 50453-3:2001-04

DIN 50453-3:2001-04

Withdrawn Most Recent

Testing of materials for semiconductor technology - Determination of etch rates of etching mixtures - Part 3: Aluminium, gravimetric method

€34.30

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