29.045 : Semiconducting materials

PD IEC/TR 60146-1-2:2011

PD IEC/TR 60146-1-2:2011

Superseded Historical

Semiconductor converters. General requirements and line commutated converters Application guide

€404.00

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BS EN IEC 60146-1-1:2024

BS EN IEC 60146-1-1:2024

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Semiconductor converters. General requirements and line commutated converters Specification of basic

€404.00

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NF EN 62047-22, C96-050-22 (12/2014)

NF EN 62047-22, C96-050-22 (12/2014)

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Semiconductor devices - Micro-electromechanical devices - Part 22 : electromechanical tensile test method for conductive thin films on flexible substrates - Dispositifs à semiconducteurs

€95.67

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NF EN 62047-18, C96-050-18 (02/2014)

NF EN 62047-18, C96-050-18 (02/2014)

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Semiconductor devices - Micro-electromechanical devices - Part 18 : bend testing methods of thin film materials - Dispositifs à semiconducteurs

€95.67

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NF EN 62047-11, C96-050-11 (03/2014)

NF EN 62047-11, C96-050-11 (03/2014)

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Semiconductor devices - Micro-electromechanical devices - Part 11 : test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems - Dispositifs à semiconducteurs

€95.67

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DIN 50456-3:1999-08

DIN 50456-3:1999-08

Withdrawn Most Recent

Testing of materials for semiconductor technology - Method for the characterisation of moulding compounds for electronic components - Part 3: Determination of cationic impurities

€34.30

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NF EN 62047-26, C96-050-26 (06/2016)

NF EN 62047-26, C96-050-26 (06/2016)

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Semiconductor devices - Micro-electromechanical devices - Part 26 : description and measurement methods for micro trench and needle structures

€93.67

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NF EN 62047-25, C96-050-25 (12/2016)

NF EN 62047-25, C96-050-25 (12/2016)

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Semiconductor devices - Micro-electromechanical devices - Part 25 : silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area

€111.67

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DIN 50455-1:2009-10

DIN 50455-1:2009-10

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Testing of materials for semiconductor technology - Methods for characterizing photoresists - Part 1: Determination of coating thickness with optical methods

€41.78

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DIN 50452-2:2009-10

DIN 50452-2:2009-10

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Testing of materials for semiconductor technology - Test method for particle analysis in liquids - Part 2: Determination of particles by optical particle counters

€56.17

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DIN 50451-4:2007-02

DIN 50451-4:2007-02

Superseded Historical

Testing of materials for semiconductor technology - Determination of trace elements in liquids - Part 4: Determination of 34 elements in ultra pure water by mass spectrometry with inductively coupled plasma (ICP-MS)

€63.27

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DIN 50452-3:1995-10

DIN 50452-3:1995-10

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Testing of materials for semiconductor technology - Test method for particle analysis in liquids - Part 3: Calibration of optical particle counters

€41.78

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DIN 50452-1:1995-11

DIN 50452-1:1995-11

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Testing of materials for semiconductor technology - Test method for particle analysis in liquids - Part 1: Microscopic determination of particles

€34.30

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DIN 50441-1:1996-07 (R2021)

DIN 50441-1:1996-07 (R2021)

Withdrawn Most Recent

Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 1: Thickness and thickness variation

€34.30

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DIN 50450-4:1993-09

DIN 50450-4:1993-09

Withdrawn Most Recent

Testing of materials for semiconductor technology; determination of impurities in carrier gases and dopant gases; determination of C-C-hydrocarbons in nitrogen by gas-chromatography

€34.30

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