29.045 : Semiconducting materials

IEC 62899-503-3:2021

IEC 62899-503-3:2021

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Printed electronics - Part 503-3: Quality assessment - Measuring method of contact resistance for the printed thin film transistor - Transfer length method

€88.00

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DIN 50450-9:2021-07

DIN 50450-9:2021-07

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Testing of materials for semiconductor technology - Determination of impurities in carrier gases and dopant gases - Part 9: Determination of oxygen, nitrogen, carbonmonoxide, carbondioxide, hydrogen and C-C-hydrocarbons in gaseous hydrogen chloride by gaschromatography

€41.78

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BS IEC 62899-503-1:2020

BS IEC 62899-503-1:2020

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Printed electronics Quality assessment. Test method of displacement current measurement for printed thin-film transistor

€183.00

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IEC 62899-503-1:2020

IEC 62899-503-1:2020

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Printed electronics - Part 503-1: Quality assessment - Test method of displacement current measurement for printed thin-film transistor

€88.00

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PD IEC TR 60146-1-2:2019

PD IEC TR 60146-1-2:2019

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Semiconductor converters. General requirements and line commutated converters Application guide

€404.00

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IEC TR 60146-1-2:2019

IEC TR 60146-1-2:2019

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IEC TR 60146-1-2:2019 Semiconductor converters - General requirements and line commutated converters - Part 1-2: Application guidelines

€446.00

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DIN 50451-7:2018-04

DIN 50451-7:2018-04

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Testing of materials for semiconductor technology - Determination of traces of elements in liquids - Part 7: Determination of 31 elements in high-purity hydrochloric acid by ICP-MS

€63.27

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DIN SPEC 1994:2017-02

DIN SPEC 1994:2017-02

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Testing of materials for semiconductor technology - Determination of anions in weak acids

€45.05

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ASTM F980-16(2024)

ASTM F980-16(2024)

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Standard Guide for Measurement of Rapid Annealing of Neutron-Induced Displacement Damage in Silicon Semiconductor Devices

€65.00

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NF EN 62047-25, C96-050-25 (12/2016)

NF EN 62047-25, C96-050-25 (12/2016)

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Semiconductor devices - Micro-electromechanical devices - Part 25 : silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area

€111.67

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NF EN 62047-26, C96-050-26 (06/2016)

NF EN 62047-26, C96-050-26 (06/2016)

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Semiconductor devices - Micro-electromechanical devices - Part 26 : description and measurement methods for micro trench and needle structures

€93.67

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NF EN 62047-22, C96-050-22 (12/2014)

NF EN 62047-22, C96-050-22 (12/2014)

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Semiconductor devices - Micro-electromechanical devices - Part 22 : electromechanical tensile test method for conductive thin films on flexible substrates - Dispositifs à semiconducteurs

€95.67

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DIN 50451-3:2014-11

DIN 50451-3:2014-11

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Testing of materials for semiconductor technology - Determination of traces of elements in liquids - Part 3: Determination of 31 elements in high-purity nitric acid by ICP-MS

€77.20

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DIN 50451-6:2014-11

DIN 50451-6:2014-11

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Testing of materials for semiconductor technology - Determination of traces of elements in liquids - Part 6: Determination of 36 elements in a high-purity ammonium fluoride solution (NHF) and in etching mixtures of high-purity ammonium fluoride solution containing hydrofluoric acid

€63.27

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NF EN 62047-11, C96-050-11 (03/2014)

NF EN 62047-11, C96-050-11 (03/2014)

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Semiconductor devices - Micro-electromechanical devices - Part 11 : test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems - Dispositifs à semiconducteurs

€95.67

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