Amendment 1 - Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors
€22.00
Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors
€869.00
Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting
€88.00
Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices
€127.00
Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
Mechanical standardization of semiconductor devices - Part 6-13 : design guideline of open-top-type sockets for fine-pitch ball grid array (FBGA) and fine-pitch land grid array (FLGA)
€95.67
Mechanical standardization of semiconductor devices Design guideline open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Land (FLGA)
€269.00
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (IEC 62047-26:2016); German version EN 62047-26:2016
€116.64
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (IEC 62047-1:2016); German version EN 62047-1:2016.
€128.22
Semiconductor devices - Micro-electromechanical devices - Part 25 : silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
€111.96
Semiconductor devices - Mechanical and climatic test methods - Part 44 : neutron beam irradiated single event effect (SEE) test method for semiconductor devices
Semiconductor devices. Micro-electromechanical devices Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength micro bonding area
Semiconductor devices. Mechanical and climatic test methods Neutron beam irradiated single event effect (SEE) method for semiconductor devices
Semiconductor devices - Micro-electromechanical devices - Part 1 : terms and definitions
€126.10
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
