Semiconductor devices. Micro-electromechanical devices RF MEMS switches
€316.00
Semiconductor devices - Part 16-3 : microwave integrated circuits - Frequency converters
€77.67
Semiconductor devices. Micro-electromechanical devices Wafer to wafer bonding strength measurement for MEMS
€269.00
Semiconductor devices - Micro-electromechanical devices - Part 14 : forming limit measuring method of metallic film materials - Dispositifs à semiconducteurs
€95.67
Semiconductor devices - Micro-electromechanical devices - Part 13 : bend - and shear - type test methods of measuring adhesive strenght for MEMS structures - Dispositifs à semiconducteurs
Semiconductor devices - Micro-electromechanical devices - Part 10 : micro-pillar compression test for MEMS materials - Dispositifs à semiconducteur
Semiconductor die products - Part 4: Questionnaire for die users and suppliers
€127.00
Semiconductor devices - Micro-electromechanical devices - Part 12 : bending fatigue testing method of thin film materials using resonant vibration of MEMS structures - Dispositifs à semiconducteurs
€93.67
Semiconductor devices - Part 16-4 : microwave integrated circuits - Switches
Semiconductor devices. Micro-electromechanical devices Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
€193.00
Semiconductor devices. Micro-electromechanical devices Forming limit measuring method of metallic film materials
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 5 : commutateurs MEMS-RF
€138.00
Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
€0.00
Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
