Semiconductor die products - Part 1 : procurement and use
€119.48
LED modules for general lighting - Safety specifications
€64.00
SEMICONDUCTOR DEVICES. PART 11: SECTIONAL SPECIFICATION FOR DISCRETE DEVICES.
€61.00
IEC 822 VSB. PARALLEL SUB-SYSTEM BUS OF THE IEC 821 VMEBUS.
€157.00
Semiconductor devices - Part 16-8: Microwave integrated circuits - Limiters (IEC 60747-16-8:2022); German version EN IEC 60747-16-8:2023
€128.22
Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators (IEC 60747-16-7:2022); German version EN IEC 60747-16-7:2023
€140.00
IEC 62047-6:2009 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
€93.00
IEC 62258-1:2009 Semiconductor die products - Part 1: Procurement and use
€342.00
IEC 60747-14-3:2009 Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
€133.00
IEC 62384:2006/AMD1:2009 Amendment 1 - DC or AC supplied electronic control gear for LED modules - Performance requirements
€12.00
IEC TR 62258-3:2010 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
€389.00
IEC 62374-1:2010 Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
IEC 60747-15:2010 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
€186.00
IEC 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
IEC 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats
€441.00
