31.080.99 : Other semiconductor devices

IEC 62830-1:2017

IEC 62830-1:2017

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Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting

€176.00

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IEC 60747-16-1:2001/AMD2:2017

IEC 60747-16-1:2001/AMD2:2017

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Amendment 2 - Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers

€22.00

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IEC 60747-16-1:2001+AMD1:2007+AMD2:2017 Consolidated

IEC 60747-16-1:2001+AMD1:2007+AMD2:2017 Consolidated

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Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers

€825.00

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IEC 62830-2:2017

IEC 62830-2:2017

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Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting

€88.00

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IEC 62047-28:2017

IEC 62047-28:2017

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Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices

€127.00

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IEC 62047-27:2017

IEC 62047-27:2017

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Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

€88.00

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NF EN 62047-25, C96-050-25 (12/2016)

NF EN 62047-25, C96-050-25 (12/2016)

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Semiconductor devices - Micro-electromechanical devices - Part 25 : silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area

€111.67

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BS EN 62047-25:2016

BS EN 62047-25:2016

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Semiconductor devices. Micro-electromechanical devices Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength micro bonding area

€269.00

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NF EN 62047-1, C96-050-1 (11/2016)

NF EN 62047-1, C96-050-1 (11/2016)

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Semiconductor devices - Micro-electromechanical devices - Part 1 : terms and definitions

€126.00

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IEC 62047-25:2016

IEC 62047-25:2016

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Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area

€176.00

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NF EN 62047-26, C96-050-26 (06/2016)

NF EN 62047-26, C96-050-26 (06/2016)

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Semiconductor devices - Micro-electromechanical devices - Part 26 : description and measurement methods for micro trench and needle structures

€93.67

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BS EN 62047-26:2016

BS EN 62047-26:2016

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Semiconductor devices. Micro-electromechanical devices Description and measurement methods for micro trench needle structures

€316.00

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BS EN 62047-1:2016

BS EN 62047-1:2016

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Semiconductor devices. Micro-electromechanical devices Terms and definitions

€316.00

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IEC 60747-5-7:2016

IEC 60747-5-7:2016

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Semiconductor devices - Part 5-7: Optoelectronic devices - Photodiodes and phototransistors

€176.00

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IEC 62047-26:2016

IEC 62047-26:2016

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Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures

€231.00

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