IEC 63373:2022 Dynamic on-resistance test method guidelines for GaN HEMT based power conversion devices
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MICROPROCESSOR SYSTEM BUS FOR 1 TO 4 BYTE DATA.
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Semiconductor devices - Part 16-3 : microwave integrated circuits - Frequency converters
€59.33
Semiconductor devices - Part 16-4 : microwave integrated circuits - Switches
Semiconductor devices - Part 16-5 : microwave integrated circuits - Oscillators
Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (IEC 47E/649/CD:2019); Text in German and English
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LED modules for general lighting - Safety specifications
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DC or AC supplied electronic controlgear for LED modules - Performance requirements
€69.00
€35.00
€40.00
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Semiconductor devices - Micro-electromechanical devices - Part 12 : bending fatigue testing method of thin film materials using resonant vibration of MEMS structures - Dispositifs à semiconducteurs
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Semiconductor die products - Part 2 : exchange data formats
€143.80
