Semiconductor die products EXPRESS model schema for data exchange
€269.00
Semiconductor devices. Micro-electromechanical devices Micro-pillar compression test for MEMS materials
€193.00
Semiconductor devices. Micro-electromechanical devices Test method for coefficients of linear thermal expansion free-standing materials micro-electromechanical systems
Semiconductor devices. Micro-electromechanical devices Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
Semiconductor devices. Micro-electromechanical devices Test method of bonding strength between PDMS and glass
Hand-held motor-operated electric tools. Safety General requirements
€404.00
Semiconductor devices. Micro-electromechanical devices Tensile testing method of thin film materials
Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz radiated emissions. TEM cell and wideband method
Semiconductor devices. Time dependent dielectric breakdown (TDDB) test for gate dielectric films
Semiconductor devices. Micro-electromechanical devices Thin film standard test piece for tensile testing
€165.00
Automatic electrical controls for household and similar use General requirements
Semiconductor devices. Micro-electromechanical devices Bend testing methods of thin film materials
Semiconductor devices. Micro-electromechanical devices Bulge test method for measuring mechanical properties of thin films
€316.00
Semiconductor devices. Micro-electromechanical devices Forming limit measuring method of metallic film materials
Semiconductor die products Questionnaire for users and suppliers
