Dynamic on-resistance test method guidelines for GaN HEMT based power conversion devices
€88.00
Semiconductor devices - Part 5-15: Optoelectronic devices - Light emitting diodes - Test method of the flat-band voltage based on the electroreflectance spectroscopy
BS EN IEC 60747-5-16. Semiconductor devices Part 5-16. Optoelectronic devices. Light emitting diodes. Test method of the flat-band voltage based on photocurrent spectroscopy
€23.00
Semiconductor devices Optoelectronic devices. Light emitting diodes. Test method of LED efficiencies
€404.00
Semiconductor devices. devices for wireless power transfer and charging General requirements specifications
€316.00
Semiconductor devices. devices for energy harvesting and generation Test evaluation methods of flexible stretchable supercapacitors use in low power electronics
Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 8: Test and evaluation methods of flexible and stretchable supercapacitors for use in low power electronics
€286.00
Semiconductor devices - Part 5-12: Optoelectronic devices - Light emitting diodes - Test method of LED efficiencies
€418.00
Semiconductor devices. Micro-electromechanical devices Test methods of micro-electromechanical inertial shock switch threshold
€165.00
Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications
Semiconductor devices - Micro-electromechanical devices - Part 40:Test methods of micro-electromechanical inertial shock switch threshold
€44.00
Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (IEC 60747-16-5:2013 + A1:2020 + COR1:2020); German version EN 60747-16-5:2013 + A1:2020.
€140.00
Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers (IEC 60747-16-6:2019); German version EN IEC 60747-16-6:2019
€116.64
BS IEC 63150-2. Semiconductor devices. Measurement and evaluation methods of kinetic energy harvesting devices under practical vibration environment Part 2. Human arm swing motion
Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection
€193.00
