Mechanical standardization of semiconductor devices General rules for the preparation outline drawings surface mounted device packages
€316.00
Semiconductor devices. Mechanical and climatic test methods Resistance of plastic encapsulated SMDs to the combined effect moisture soldering heat
€269.00
Semiconductor optoelectronic devices for fibre optic system applications Measuring methods
Semiconductor devices General
€355.00
Semiconductor devices. Mechanical and climatic test methods Die shear strength
€165.00
Semiconductor devices. Mechanical and climatic test methods Preconditioning of non-hermetic surface mount devices prior to reliability testing
€193.00
Semiconductor devices. Mechanical and climatic test methods Internal moisture content measurement the analysis of other residual gases
Semiconductor devices. Mechanical and climatic test methods High temperature operating life
Semiconductor devices. Mechanical and climatic test methods Flammability of plastic-encapsulated devices (externally induced)
Semiconductor devices. Mechanical and climatic test methods Solderability
Semiconductor devices. Mechanical and climatic test methods Latch-up
Semiconductor devices. Mechanical and climatic test methods Power cycling
Harmonized system of quality assessment for electronic components. Discrete semiconductor devices. Sectional specification
Mechanical standardization of semiconductor devices General rules for the preparation outline drawings surface mounted device packages. Design guidelines fine-pitch land grid array (FLGA)
Hand-held motor-operated electric tools. Safety General requirements
€404.00
