31.180 : Printed circuits and boards

ASTM D1867-07

ASTM D1867-07

Superseded Historical

Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring

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ASTM B885-09

ASTM B885-09

Superseded Historical

Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts

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ASTM B885-09(2015)

ASTM B885-09(2015)

Superseded Historical

Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts

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BS EN 123100-800:1992

BS EN 123100-800:1992

Superseded Historical

Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plain holes

€269.00

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BS EN 123200-800:1992

BS EN 123200-800:1992

Superseded Historical

Harmonized system of quality assessment for electronic components: capability detail specification: single and double sided printed boards with plated-through holes

€269.00

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BS EN 123300-800:1992

BS EN 123300-800:1992

Superseded Historical

Specification for harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards

€193.00

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25/30511698 DC:2025

25/30511698 DC:2025

Active Most Recent

Draft BS EN 61189-5-501 Test methods for electrical materials, printed boards and other interconnection structures assemblies Part 5-501: General test materials - Surface insulation resistance (SIR) testing of solder fluxes

€23.00

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IEC TR 61188-8:2021

IEC TR 61188-8:2021

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IEC TR 61188-8:2021 Circuit boards and circuit board assemblies - Design and use - Part 8: 3D shape data for CAD component library

€133.00

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IEC 62899-202-7:2021

IEC 62899-202-7:2021

Active Most Recent

IEC 62899-202-7:2021 Printed electronics - Part 202-7: Materials - Printed film - Measurement of peel strength for printed layer on flexible substrate by 90° peel method

€93.00

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IEC TR 61191-8:2021

IEC TR 61191-8:2021

Active Most Recent

IEC TR 61191-8:2021 Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices

€302.00

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IEC 62899-402-3:2021

IEC 62899-402-3:2021

Active Most Recent

IEC 62899-402-3:2021 Printed electronics - Part 402-3: Printability - Measurement of qualities - Voids in printed pattern using a two-dimensional optical image

€133.00

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IEC TR 62878-2-8:2021

IEC TR 62878-2-8:2021

Active Most Recent

IEC TR 62878-2-8:2021 Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate

€93.00

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IEC TR 62899-402-4:2021

IEC TR 62899-402-4:2021

Active Most Recent

IEC TR 62899-402-4:2021 Printed electronics - Part 402-4: Printability - Measurement of qualities - Classification and measurement methods for morphology

€133.00

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IEC 62899-201-2:2021

IEC 62899-201-2:2021

Active Most Recent

IEC 62899-201-2:2021 Printed electronics - Part 201-2: Materials - Substrates - Measurement methods for properties of stretchable substrates

€46.00

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IEC 62899-202-4:2021

IEC 62899-202-4:2021

Active Most Recent

IEC 62899-202-4:2021 Printed electronics - Part 202-4: Materials - Conductive ink - Measurement methods for properties of stretchable printed layers (conductive and insulating)

€186.00

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