Test Method for Determining the Electrical Resistivity of a Printed Conductive Material
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Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts
Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards
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Space product assurance. Qualification of printed circuit boards
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Space product assurance. Procurement of printed circuit boards
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BS EN IEC 61249-2-54 Materials for printed boards and other interconnecting structures Part 2-54. Reinforced base materials clad unclad. Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) flammability (vertical burning test), copper-clad high speed applications
€23.00
BS EN IEC 63516 Fixed folding durability test method for flexible opto-electric circuit boards
BS EN IEC 63203-302-1 Wearable electronic devices and technologies Part 302-1: Materials - Test method for torsion of conductive stretchable films
BS EN IEC 63609-3 Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements Part 3: Determination for temperature measurement in using thermocouples
BS IEC 62899-202-13 Printed electronics Part 202-13: Materials - Resistance measurement method for conductive layer in printed and in-mould
BS IEC 62899-202-14 Printed electronics Part 202-14: Materials - Test methods of conductive ink suitability for screen printing
BS EN IEC 61189-3-720 Test methods for electrical materials, printed boards and other interconnection structures assemblies Part 3-720: (circuit boards) - Transmission loss test method high frequency multilayer circuit
Printed electronics Material technologies required in printed for wearable smart devices
€193.00