IEC TS 62878-2-3:2015 Device embedded substrate - Part 2-3: Guidelines - Design guide
€186.00
IEC TS 62878-2-4:2015 Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
€302.00
IEC TS 62878-2-1:2015 Device embedded substrate - Part 2-1: Guidelines - General description of technology
€244.00
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
€551.00
IEC 61189-2-721:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator
IEC 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
€389.00
Base materials for printed circuits - Part 2: Specifications; Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board (IEC 60249-2-17:1992 + A1:1993 + A2:1994 + A3:2000); German version EN 60249-2-17:1993 + A1:1994 + A2:1995 + A3:2000.
€69.91
Connecteurs pour fréquences inférieures à 3 MHz pour utilisation avec cartes imprimées - Partie 8 : connecteurs pour cartes imprimées en deux parties, pour grille de base de 2,54 mm (0,1 in) à contacts mâles de section 0,63 mm X 0,63 mm.
€153.00
Standard Test Method for Relative Permittivity (Dielectric Constant) and Dissipation Factor of Polymer-Based Microwave Circuit Substrates
€72.00
BS ISO 13060 An adhesion evaluation method for microcircuits on PCB (Printed Circuit Board) by scratch test
€23.00
Cartes à circuits optiques - Norme de performance - Partie 3-1 : cartes à circuits optiques souples utilisant des fibres optiques en silice non connectorisées
€95.67
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (IEC 62878-2-603:2025); German version EN IEC 62878-2-603:2025
€91.03
Fixed folding durability test method for flexible opto-electric circuit boards (IEC 91/2046/CDV:2025); German and English version prEN IEC 63516:2025
€98.32
This product is not for sale, please contact us for more information
Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
