IEC 60194-2:2017 Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies
€342.00
IEC 61249-2-46:2018 Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
€186.00
IEC 61249-2-45:2018 Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
IEC 61249-2-47:2018 Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
IEC 62899-403-1:2018 Printed electronics - Part 403-1: Printability - Requirements for reproducibility - Basic patterns for evaluation of printing machine
IEC 62899-202-5:2018 Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate
€93.00
IEC 62899-201:2016/AMD1:2018 Amendment 1 - Printed electronics - Part 201: Materials - Substrates
IEC 62899-202-3:2019 Printed electronics - Part 202-3: Materials - Conductive ink - Measurement of sheet resistance of conductive films - Contactless method
IEC TR 62878-2-7:2019 Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
IEC 62899-204:2019 Printed electronics - Part 204: Materials - Insulator ink - Measurement methods of properties of insulator inks and printed insulating layers
IEC TR 61189-5-506:2019 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
IEC 62878-2-5:2019 Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
€389.00
IEC 62878-1:2019 Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
€133.00
IEC TR 61191-7:2020 Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies
€470.00
IEC 60947-4-3:2020 Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - Semiconductor controllers and semiconductor contactors for non-motor loads
€441.00
