Dimensions of mechanical structures of the 482,6 mm (19in) series - Part 5: Subracks and associated plug-in for EMC, ESD, injector/extractor and keying (IEC 48D/119/CD:1997)
€91.03
Harmonized system of quality assessment for electronic components. Sectional specification. Flexible multilayer printed boards with through connections
€355.00
Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid multilayer printed boards with through connections
Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid double sided printed boards with through connections
€316.00
Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
€418.00
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
€369.00
IEC 62326-3-1: Printed boards - Part 3: Rigid single and double-sided printed boards with interlayer connections; Section 1: Capability detail specification; performance level A, B und C (IEC 52/677/CD:1996)
€134.02
IEC 62326-2-1: Printed boards - Part 2: Rigid single and double-sided printed boards without interlayer connections; Section 1: Capability detail specification; performance level A, B und C (IEC 52/675/CD:1996)
€128.22
IEC 62326-3: Printed boards - Part 3: Rigid single and double-sided printed boards with interlayer connections; sectional specification (IEC 52/676/CD:1996)
IEC 62326-2: Printed boards - Part 2: Rigid single and double-sided printed boards without interlayer connections; sectional specification (IEC 52/674/CD:1996)
€98.32
Bow and twist requirements - Amendment to IEC 60249-2-1 to 7, 9, 10, 14, 16, 18; Sub-clause 5.3 und 6.3 (IEC 52/669/CD:1996)
€41.78
Introduction of a new subclause 6.6 to IEC 60249-2-4, 60249-2-5, 60249-2-11 and 60249-2-12 - Concerning the requirements for glass transition temperature and cure factor (IEC 52/670/CDV:1996)
Process assessment schedule for printed board design facilities
Grid systems for printed circuits
€51.00
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº5: EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).
€65.00
