IEC 61189-2: Test methods for materials for interconnection structures - Test E04: Volume resistivity and surface resistivity (IEC 52(Secretariat)472:1994)
€48.79
IEC 61189-2: Test methods for materials for interconnection structures - Test E14: Arc resistance (IEC 52(Secretariat)473:1994)
IEC 61189-2: Test methods for materials for interconnection structures - Test M25: Time to delamination by TMA (IEC 52(Secretariat)474:1994)
€34.30
IEC 61189-2: Test methods for materials for interconnection structures - Test M27: Resin flow properties of coverlay films, bonding films and adhesive cast films used in the fabrication of flexible printed wiring boards (IEC 52(Secretariat)475:1994)
IEC 61189-3: Test methods for interconnection structures (Printed boards) - Test E08: PTH resistance change, thermal cycling (IEC 52(Secretariat)477:1994)
€56.17
IEC 61189-3: Test methods for interconnection structures (Printed boards) - Test N01: Thermal shock, immersion, oil bath (IEC 52(Secretariat)478:1994)
IEC 61189-3: Test methods for interconnection structures (Printed boards) - Test N04: Thermal shock, dip soldering (IEC 52(Secretariat)479:1994)
IEC 61189-3: Test methods for interconnection structures (Printed boards) - Test N05: Thermal shock, floating, solder bath 280 °C (IEC 52(Secretariat)480:1994)
€41.78
IEC 61189-3: Test methods for interconnection structures (Printed boards) - Test N06: Damp heat, steady state (IEC 52(Secretariat)481:1994)
IEC 61189-3: Test methods for interconnection structures (Printed boards) - Test N08: Thermal shock, immersion fluidized sand bath (IEC 52(Secretariat)482:1994)
IEC 61189-3: Test methods for interconnection structures (Printed boards) - Test N10: Pre-conditioning, standard atmospheric conditions (IEC 52(Secretariat)483:1994)
IEC 61189-3: Test methods for interconnection structures (Printed boards) - Test N11: Pre-conditioning, 125 °C (IEC 52(Secretariat)484:1994)
IEC 61189-3: Test methods for interconnection structures (Printed boards) - Test X07: Edge dip test for surface mount conductors and attachment lands (IEC 52(Secretariat)485:1994)
€69.91
IEC 61189-3: Test methods for interconnection structures (Printed boards) - Test X10: Rotary dip test for plated through holes, surface mount conductors and attachment lands (IEC 52(Secretariat)486:1994)
€77.20
IEC 61189-3: Test methods for interconnection structures (Printed boards) - Test E07: Controlled impedance testing by Time Domain Reflectometry (TDR) (IEC 52(Secretariat)476:1994)
€84.58
