Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 91/896/CD:2009)
€111.40
Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High Performance, modified, non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 91/889/CD:2009)
Printed boards - Part 3: Safety certification of rigid printed circuit boards for electronic assemblies (IEC 91/384/CD:2003)
€140.00
Materials for interconnection structures - Part 2-22: Sectional specification set for reinforced base material clad and unclad; Modified non-halogenated epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad (IEC 91/396/CDV:2003); German version prEN 61249-2-22:2003
€91.03
Materials for interconnection structures - Part 6-3: Sectional specification for reinforcements; Woven fibreglass fabrics (IEC 91/393/CD:2003)
Materials for printed boards and other interconnection structures - Part 2-1: Sectional specification set for reinforced base materials, clad and unclad; Phenolic cellulose paper reinforced laminate sheet, economic grade, copper clad (IEC 91/316/CDV:2002); German version prEN 61249-2-1:2002
€84.58
Materials for printed boards and other interconnection structures - Part 2-2: Sectional specification set for reinforced base materials clad and unclad; Phenolic cellulose paper reinforced laminate, high electrical grade, copper clad (IEC 91/317/CDV:2002); German version prEN 61249-2-2:2002
Amendment 2 to IEC 61189-3: Test methods for electrical material, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (IEC 91/314/CD:2002)
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies (IEC 91/310/CD:2002)
€150.65
Printed board and printed board assemblies - Design and use - Part 5-8 : Sectional Requirement - Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) (IEC 91/416/CD:2003)
Printed board and printed board assemblies - Design and use - Part 5-5: Sectional requirements - Attachment (land/joint) considerations - Components with gull-wing leads on four sides (IEC 91/465/CDV:2004); German version prEN 61188-5-5:2004
€134.02
Printed boards and printed board assemblies - Design and use - Part 5-4: Sectional requirements - Attachment (land/joint) consideration - Components with J leads on two sides (IEC 91/464/CDV:2004); German version prEN 61188-5-4:2004
€63.27
Printed boards and printed board assemblies - design and use - Part 5-3: Sectional requirements - attachment (land/joint) considerations - components with gull-wing leads on two sides (IEC 91/463/CDV:2004); German version prEN 61188-5-3:2004
Printed boards - Part 1: Generic specification (IEC 62326-1:1996); German version EN 62326-1:1997.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology (IEC 61189-1:1997); German version EN 61189-1:1997.
€69.91
