31.180 : Printed circuits and boards

DIN EN 60249-2-1:2000-12

DIN EN 60249-2-1:2000-12

Withdrawn Most Recent

Base materials for printed circuits - Part 2: Specifications; Specification No. 1: Phenolic cellulose paper copper-clad laminated sheet, high electrical quality (IEC 60249-2-1:1985 + A1:1989 + A2:1993 + A3:1994 + A4:2000); German version EN 60249-2-1:1994 + A2:1994 + Corrig.:1994 + A3:1995 + A4:2000.

€77.20

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DIN EN 60249-2-2:2000-12

DIN EN 60249-2-2:2000-12

Withdrawn Most Recent

Base materials for printed circuits - Part 2: Specifications; Specification No. 2: Phenolic cellulose paper copper-clad laminated sheet, economic quality (IEC 60249-2-2:1985 + A1:1989 + A2:1990 + A3:1993 + A4:1994 + A5:2000); German version EN 60249-2-2:1994 + A3:1994 + Corrig.:1994 + A4:1995 + A5:2000.

€77.20

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BS 6221-25:2000

BS 6221-25:2000

Withdrawn Most Recent

Printed wiring boards Guide to the rework and repair of soldered surface mounted printed board assemblies

€269.00

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NF EN 60249-2-4/A5, C93-754/A1 (10/2000)

NF EN 60249-2-4/A5, C93-754/A1 (10/2000)

Withdrawn Most Recent

Matériaux de base pour circuits imprimés - Partie 2 : spécifications - Spécification n° 4 : feuille de tissu de verre époxyde recouverte de cuivre, de qualité courante

€59.33

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IEC 60249-2-10:1987/AMD5:2000

IEC 60249-2-10:1987/AMD5:2000

Superseded Historical

Amendment 5 - Base materials for printed circuits. Part 2: Specifications. Specification No. 10: Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)

€22.00

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IEC 60249-2-11:1987/AMD4:2000

IEC 60249-2-11:1987/AMD4:2000

Withdrawn Most Recent

Amendment 4 - Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards

€22.00

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IEC 60249-2-14:1988/AMD5:2000

IEC 60249-2-14:1988/AMD5:2000

Superseded Historical

Amendment 5 - Base materials for printed circuits. Part 2: Specifications. Specification No. 14: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test), economic quality

€22.00

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IEC 60249-2-17:1992/AMD3:2000

IEC 60249-2-17:1992/AMD3:2000

Superseded Historical

Amendment 3 - Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

€11.00

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IEC 60249-2-18:1992/AMD3:2000

IEC 60249-2-18:1992/AMD3:2000

Superseded Historical

Amendment 3 - Base materials for printed circuits - Part 2: Specifications - Specification No. 18: Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

€22.00

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IEC 60249-2-9:1987/AMD5:2000

IEC 60249-2-9:1987/AMD5:2000

Superseded Historical

Amendment 5 - Base materials for printed circuits. Part 2: Specifications. Specification No. 9: Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test)

€22.00

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IEC 60249-2-16:1992/AMD3:2000

IEC 60249-2-16:1992/AMD3:2000

Superseded Historical

Amendment 3 - Base materials for printed circuits - Part 2: Specifications - Specification No. 16: Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

€22.00

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IEC PAS 62158:2000

IEC PAS 62158:2000

Withdrawn Most Recent

Printed Board Manufacturers' Qualification Profile (MQP)

€325.00

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IEC PAS 62159:2000

IEC PAS 62159:2000

Withdrawn Most Recent

Electronic Assembly Manufacturers' Qualification Profile (AQP)

€369.00

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IEC PAS 62160:2000

IEC PAS 62160:2000

Withdrawn Most Recent

Laminator Qualification Profile

€176.00

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BS EN 61189-3:1997

BS EN 61189-3:1997

Superseded Historical

Test methods for electrical materials, printed boards and other interconnection structures assemblies (printed boards)

€374.00

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