31.180 : Printed circuits and boards

NF EN 60249-2-2/A5, C93-752/A1 (01/2001)

NF EN 60249-2-2/A5, C93-752/A1 (01/2001)

Withdrawn Most Recent

Matériaux de base pour circuits imprimés - Partie 2 : spécifications - Spécification n° 2 : feuille de papier cellulose phénolique recouverte de cuivre de qualité économique

€56.33

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NF EN 60249-2-3/A4, C93-753/A1 (02/2001)

NF EN 60249-2-3/A4, C93-753/A1 (02/2001)

Withdrawn Most Recent

Matériaux de base pour circuits imprimés - Partie 2 : spécifications - Spécification n° 3 : feuille de papier cellulose phénolique époxyde recouverte de cuivre, d'inflammabilité définie (essai de combustion verticale)

€29.00

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NF EN 60249-2-1/A4, C93-749/A1 (02/2001)

NF EN 60249-2-1/A4, C93-749/A1 (02/2001)

Withdrawn Most Recent

Matériaux de base pour circuits imprimés - Partie 2 : spécifications - Spécification n° 1 : feuille de papier cellulose phénolique recouverte de cuivre de haute qualité électrique

€32.33

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NF EN 60249-2-5/A5, C93-755/A1 (09/2001)

NF EN 60249-2-5/A5, C93-755/A1 (09/2001)

Superseded Historical

Matériaux de base pour circuits imprimés - Partie 2 : spécifications - Spécification n° 5 : feuille de tissu de verre époxyde recouverte de cuivre, d'inflammabilité définie (essai de combustion verticale)

€41.67

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DIN EN IEC 61189-2-801:2024-08

DIN EN IEC 61189-2-801:2024-08

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (IEC 61189-2-801:2023); German version EN IEC 61189-2-801:2023

€77.20

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DIN EN IEC 61189-2-803:2024-08

DIN EN IEC 61189-2-803:2024-08

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards (IEC 61189-2-803:2023); German version EN IEC 61189-2-803:2023

€63.27

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IEC 60326-2:1990

IEC 60326-2:1990

Withdrawn Most Recent

IEC 60326-2:1990 Printed boards. Part 2: Test methods

€441.00

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IEC 60326-2:1990/AMD1:1992

IEC 60326-2:1990/AMD1:1992

Withdrawn Most Recent

IEC 60326-2:1990/AMD1:1992 Amendment 1 - Printed boards. Part 2: Test methods

€12.00

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IEC 61249-5-1:1995

IEC 61249-5-1:1995

Active Most Recent

IEC 61249-5-1:1995 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)

€133.00

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IEC 61249-7-1:1995

IEC 61249-7-1:1995

Active Most Recent

IEC 61249-7-1:1995 Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/invar/copper

€23.00

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IEC 61249-8-7:1996

IEC 61249-8-7:1996

Active Most Recent

IEC 61249-8-7:1996 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks

€93.00

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IEC 62326-4:1996

IEC 62326-4:1996

Active Most Recent

IEC 62326-4:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification

€302.00

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IEC 62326-4-1:1996

IEC 62326-4-1:1996

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IEC 62326-4-1:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C

€441.00

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IEC 61189-1:1997

IEC 61189-1:1997

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IEC 61189-1:1997 Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

€133.00

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IEC 61249-8-8:1997

IEC 61249-8-8:1997

Active Most Recent

IEC 61249-8-8:1997 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings

€46.00

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